FR2176036B3 - - Google Patents

Info

Publication number
FR2176036B3
FR2176036B3 FR7309091A FR7309091A FR2176036B3 FR 2176036 B3 FR2176036 B3 FR 2176036B3 FR 7309091 A FR7309091 A FR 7309091A FR 7309091 A FR7309091 A FR 7309091A FR 2176036 B3 FR2176036 B3 FR 2176036B3
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7309091A
Other languages
French (fr)
Other versions
FR2176036A1 (el
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sifco Industries Inc
Original Assignee
Sifco Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sifco Industries Inc filed Critical Sifco Industries Inc
Publication of FR2176036A1 publication Critical patent/FR2176036A1/fr
Application granted granted Critical
Publication of FR2176036B3 publication Critical patent/FR2176036B3/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7309091A 1972-03-14 1973-03-14 Expired FR2176036B3 (el)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23459072A 1972-03-14 1972-03-14

Publications (2)

Publication Number Publication Date
FR2176036A1 FR2176036A1 (el) 1973-10-26
FR2176036B3 true FR2176036B3 (el) 1976-03-12

Family

ID=22882007

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7309091A Expired FR2176036B3 (el) 1972-03-14 1973-03-14

Country Status (5)

Country Link
US (1) US3779887A (el)
JP (1) JPS492728A (el)
BR (1) BR7301786D0 (el)
CA (1) CA989770A (el)
FR (1) FR2176036B3 (el)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1555334A (en) * 1975-06-13 1979-11-07 Imi Ltd Electrodeposition cell
EP0003680A1 (en) * 1978-02-09 1979-08-22 Weldex A.G. Method for brush electroplating, electrode and electrolyte therefor
US4406761A (en) * 1980-05-01 1983-09-27 Kabushiki Kaisha Kobe Seiko Sho Method of descaling metal sheets
FI834686A0 (fi) * 1983-12-20 1983-12-20 Niinivaara Ensi Kyoesti Juhani Foerfarande foer undervattensrening och -belaeggning
JPS61219526A (ja) * 1985-03-25 1986-09-29 Agency Of Ind Science & Technol 電解砥粒複合研磨装置用電極工具
US4609450A (en) * 1985-03-26 1986-09-02 Agency Of Industrial Science And Technology Combined electrolytic-abrasive polishing apparatus
EP0242421B1 (de) * 1986-04-25 1989-09-06 Poligrat Gmbh Verfahren und Vorrichtung zum elektrochemischen Polieren und Beizen
JP2831713B2 (ja) * 1988-08-19 1998-12-02 マルイ鍍金工業株式会社 電解処理用筆具
JPH0322968U (el) * 1989-07-13 1991-03-11
JPH0575057U (ja) * 1992-03-13 1993-10-12 日本精工株式会社 衝撃吸収式ステアリングコラム装置
US5225059A (en) * 1992-08-03 1993-07-06 W. R. Associates Apparatus for single anode brush electroplating
US5324406A (en) * 1992-09-10 1994-06-28 Tosoh Smd, Inc. Automatic brush plating machine
US5409593A (en) * 1993-12-03 1995-04-25 Sifco Industries, Inc. Method and apparatus for selective electroplating using soluble anodes
US5776330A (en) * 1996-05-08 1998-07-07 Corpex Technologies, Inc. Electrolytic decontamination methods and apparatus
US5772012A (en) * 1996-05-08 1998-06-30 Corpex Technologies, Inc. Flexible decontamination apparatus
US6939447B2 (en) 1998-04-06 2005-09-06 Tdao Limited Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
GB2336161B (en) 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US7427337B2 (en) * 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US7425250B2 (en) 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6902659B2 (en) * 1998-12-01 2005-06-07 Asm Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6673216B2 (en) * 1999-08-31 2004-01-06 Semitool, Inc. Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
IT1311147B1 (it) * 1999-11-04 2002-03-04 Edk Res Ag Macchina per pulizia localizzata con cella, elettrolitica e/o adultrasuoni, di decapaggio e/o lucidatura
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US6921551B2 (en) 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
US7754061B2 (en) 2000-08-10 2010-07-13 Novellus Systems, Inc. Method for controlling conductor deposition on predetermined portions of a wafer
US20040170753A1 (en) * 2000-12-18 2004-09-02 Basol Bulent M. Electrochemical mechanical processing using low temperature process environment
US7172497B2 (en) * 2001-01-05 2007-02-06 Asm Nutool, Inc. Fabrication of semiconductor interconnect structures
US6572755B2 (en) * 2001-04-11 2003-06-03 Speedfam-Ipec Corporation Method and apparatus for electrochemically depositing a material onto a workpiece surface
US7238092B2 (en) * 2001-09-28 2007-07-03 Novellus Systems, Inc. Low-force electrochemical mechanical processing method and apparatus
US20050040049A1 (en) * 2002-09-20 2005-02-24 Rimma Volodarsky Anode assembly for plating and planarizing a conductive layer
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
JP4628931B2 (ja) * 2005-11-04 2011-02-09 日東工器株式会社 雄雌部材アセンブリ
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
US8197307B1 (en) * 2009-03-19 2012-06-12 Kenneth Luna Surface polishing system
US9249521B2 (en) 2011-11-04 2016-02-02 Integran Technologies Inc. Flow-through consumable anodes
AU355902S (en) * 2014-05-12 2014-06-13 Electrolytic brush
AU355903S (en) * 2014-05-12 2014-06-13 Electrolytic brush
WO2023039641A1 (en) * 2021-09-17 2023-03-23 Ensitech Ip Pty Ltd Electrochemical treatment device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL68330C (el) * 1950-11-03
GB760016A (en) * 1953-09-11 1956-10-31 Glacier Co Ltd Improvements in or relating to electroplating
FR1483598A (el) * 1965-07-12 1967-09-06

Also Published As

Publication number Publication date
JPS492728A (el) 1974-01-11
FR2176036A1 (el) 1973-10-26
US3779887A (en) 1973-12-18
BR7301786D0 (pt) 1975-09-02
CA989770A (en) 1976-05-25

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Legal Events

Date Code Title Description
ST Notification of lapse