FR2162526B1 - - Google Patents

Info

Publication number
FR2162526B1
FR2162526B1 FR7243524A FR7243524A FR2162526B1 FR 2162526 B1 FR2162526 B1 FR 2162526B1 FR 7243524 A FR7243524 A FR 7243524A FR 7243524 A FR7243524 A FR 7243524A FR 2162526 B1 FR2162526 B1 FR 2162526B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7243524A
Other languages
French (fr)
Other versions
FR2162526A1 (it
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Original Assignee
Hoechst AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst AG filed Critical Hoechst AG
Publication of FR2162526A1 publication Critical patent/FR2162526A1/fr
Application granted granted Critical
Publication of FR2162526B1 publication Critical patent/FR2162526B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR7243524A 1971-12-08 1972-12-07 Expired FR2162526B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160821A DE2160821C3 (de) 1971-12-08 1971-12-08 Verfahren zur Abscheidung von Kupferschichten auf Formkörpern aus Polyimiden

Publications (2)

Publication Number Publication Date
FR2162526A1 FR2162526A1 (it) 1973-07-20
FR2162526B1 true FR2162526B1 (it) 1976-08-20

Family

ID=5827354

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7243524A Expired FR2162526B1 (it) 1971-12-08 1972-12-07

Country Status (10)

Country Link
US (1) US3881049A (it)
JP (1) JPS4866168A (it)
AT (1) AT322320B (it)
BE (1) BE792310A (it)
CA (1) CA990593A (it)
DE (1) DE2160821C3 (it)
FR (1) FR2162526B1 (it)
GB (1) GB1403219A (it)
IT (1) IT973915B (it)
NL (1) NL7216124A (it)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL176479C (nl) * 1971-12-08 1985-04-16 Hoechst Ag Werkwijze voor het bekleden van kunststofvoorwerpen met koper.
GB2040969B (en) * 1978-12-19 1983-04-13 Crown City Plating Co Conditioning of polyamides for electroless plating
DE3328765A1 (de) * 1983-08-05 1985-02-14 Schering AG, 1000 Berlin und 4709 Bergkamen Loesung zur vorbehandlung von polyimid
US4720401A (en) * 1985-01-11 1988-01-19 International Business Machines Corporation Enhanced adhesion between metals and polymers
DE3743780A1 (de) * 1987-12-23 1989-07-06 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
EP0341504A3 (en) * 1988-05-09 1991-01-16 General Electric Company Plastic chip carrier package and method of preparation
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US5178956A (en) * 1989-10-03 1993-01-12 Shipley Company Inc. Pretreatment process for electroless plating of polyimides
DE69127279T2 (de) * 1990-05-04 1998-03-19 Battelle Memorial Institute Bildung eines dünnen keramischen oxidfilms durch niederschlagung auf modifizierten polymeroberflächen
US5187241A (en) * 1990-05-15 1993-02-16 International Business Machines Corporation Isoimide modifications of a polyimide and reaction thereof with nucleophiles
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5151304A (en) * 1991-01-22 1992-09-29 International Business Machines Corporation Structure and method for enhancing adhesion to a polyimide surface
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
JP4917841B2 (ja) * 2006-06-09 2012-04-18 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 樹脂表面への無電解めっき方法
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
TWI595024B (zh) * 2016-06-23 2017-08-11 臻鼎科技股份有限公司 聚醯胺酸、覆銅板及電路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3544432A (en) * 1968-03-19 1970-12-01 Chisso Corp Electroplating plastic articles
US3704156A (en) * 1970-07-13 1972-11-28 Du Pont Catalyst solution for electroless plating on nonconductors
US3684572A (en) * 1970-07-13 1972-08-15 Du Pont Electroless nickel plating process for nonconductors
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
US3736170A (en) * 1971-06-28 1973-05-29 Ibm Process for improved adhesion of electroless copper to a polyimide surface
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface

Also Published As

Publication number Publication date
FR2162526A1 (it) 1973-07-20
CA990593A (en) 1976-06-08
DE2160821C3 (de) 1979-02-08
GB1403219A (en) 1975-08-28
DE2160821B2 (de) 1978-06-08
IT973915B (it) 1974-06-10
BE792310A (fr) 1973-06-05
JPS4866168A (it) 1973-09-11
DE2160821A1 (de) 1973-06-20
US3881049A (en) 1975-04-29
NL7216124A (it) 1973-06-13
AT322320B (de) 1975-05-12

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Legal Events

Date Code Title Description
ST Notification of lapse