FR2161199A5 - Chipboard production - using wood chips treated at least twice with glue and dried to low moisture content - Google Patents

Chipboard production - using wood chips treated at least twice with glue and dried to low moisture content

Info

Publication number
FR2161199A5
FR2161199A5 FR7141110A FR7141110A FR2161199A5 FR 2161199 A5 FR2161199 A5 FR 2161199A5 FR 7141110 A FR7141110 A FR 7141110A FR 7141110 A FR7141110 A FR 7141110A FR 2161199 A5 FR2161199 A5 FR 2161199A5
Authority
FR
France
Prior art keywords
wood chips
glueing
twice
glue
moisture content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7141110A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OESTERR HIAG WERKE AG
Original Assignee
OESTERR HIAG WERKE AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OESTERR HIAG WERKE AG filed Critical OESTERR HIAG WERKE AG
Priority to FR7141110A priority Critical patent/FR2161199A5/en
Application granted granted Critical
Publication of FR2161199A5 publication Critical patent/FR2161199A5/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08L61/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

Processing of wood chips, esp. for the central layer of chipboard, is effected by na) glueing at least twice, opt. with intermediate storage, >=15wt.% pref. all of the wood chips being processed, (b) drying the chips, after the first or second glueing, to a residual moisture content of 0.5-15, pref. 1-4%, (DIN 52183), and (c) opt. adding a curing agent during the last glueing, depending on the glue employed. The total amt. of the remaining wood chips is added to the twice glued part before the last glueing. The wood chips may be mixed with =60wt.% sawdust. Glueing is effected with urea-formaldehyde resin in the form of a 35-60% aq. soln. The processed wood chips contain >=10wt.% glue. High quality chipboard can be prepd. from the treated wood chips, even when low quality raw material e.g. waste, is used.
FR7141110A 1971-11-17 1971-11-17 Chipboard production - using wood chips treated at least twice with glue and dried to low moisture content Expired FR2161199A5 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7141110A FR2161199A5 (en) 1971-11-17 1971-11-17 Chipboard production - using wood chips treated at least twice with glue and dried to low moisture content

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7141110A FR2161199A5 (en) 1971-11-17 1971-11-17 Chipboard production - using wood chips treated at least twice with glue and dried to low moisture content

Publications (1)

Publication Number Publication Date
FR2161199A5 true FR2161199A5 (en) 1973-07-06

Family

ID=9085902

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7141110A Expired FR2161199A5 (en) 1971-11-17 1971-11-17 Chipboard production - using wood chips treated at least twice with glue and dried to low moisture content

Country Status (1)

Country Link
FR (1) FR2161199A5 (en)

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Legal Events

Date Code Title Description
ST Notification of lapse