FR2159239A1 - - Google Patents

Info

Publication number
FR2159239A1
FR2159239A1 FR7214666A FR7214666A FR2159239A1 FR 2159239 A1 FR2159239 A1 FR 2159239A1 FR 7214666 A FR7214666 A FR 7214666A FR 7214666 A FR7214666 A FR 7214666A FR 2159239 A1 FR2159239 A1 FR 2159239A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7214666A
Other languages
French (fr)
Other versions
FR2159239B1 (xx
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canada Wire and Cable Co Ltd
Original Assignee
Canada Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canada Wire and Cable Co Ltd filed Critical Canada Wire and Cable Co Ltd
Publication of FR2159239A1 publication Critical patent/FR2159239A1/fr
Application granted granted Critical
Publication of FR2159239B1 publication Critical patent/FR2159239B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR7214666A 1971-11-10 1972-04-25 Expired FR2159239B1 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE110362 1971-11-10

Publications (2)

Publication Number Publication Date
FR2159239A1 true FR2159239A1 (xx) 1973-06-22
FR2159239B1 FR2159239B1 (xx) 1977-06-17

Family

ID=3841568

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7214666A Expired FR2159239B1 (xx) 1971-11-10 1972-04-25

Country Status (5)

Country Link
US (1) US3775264A (xx)
CA (1) CA1001581A (xx)
DE (1) DE2249037A1 (xx)
FR (1) FR2159239B1 (xx)
GB (1) GB1347936A (xx)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086146A (en) * 1975-11-12 1978-04-25 W. R. Grace & Co. Water treating process
JPH08502367A (ja) * 1992-09-28 1996-03-12 デユコーア・エル・ピー Ｎ，ｎ−ジメチル−ビス（２−ヒドロキシエチル）第４アンモニウムヒドロオキサイドを使用するフォトレジストの剥離方法
TW562878B (en) * 2000-06-30 2003-11-21 Ebara Corp Copper-plating liquid, plating method and plating apparatus
FR2818294A1 (fr) * 2000-12-15 2002-06-21 Thomson Csf Revetement metallique conducteur anticorrosion, procede de fabrication dudit revetement, et produit utilise dans ledit procede
CN102212855B (zh) * 2011-05-20 2012-07-11 湘潭大学 一种具有高耐腐蚀性能的可锡焊铝带及其制备工艺
CN103225091A (zh) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 一种铝材镀铜液
FR3053352A1 (fr) 2016-07-04 2018-01-05 Airbus Safran Launchers Sas Composition de protection anticorrosion
DE112020002118T5 (de) * 2019-04-26 2022-01-27 Sumitomo Electric Industries, Ltd. Aluminiumbasisdraht, Litzendraht, und Verfahren zur Herstellung von Aluminiumbasisdraht
CN111769300B (zh) * 2020-02-28 2023-06-30 上海市机电设计研究院有限公司 全钒液流电池用铝基镀铜集流板的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195454A (en) * 1939-01-07 1940-04-02 Louis Weisberg Inc Electrodeposition of copper
BE767398A (fr) * 1970-05-25 1971-10-18 Canada Wire & Cable Co Ltd Procede de placage de cuivre sur de l'aluminium

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2872346A (en) * 1956-05-21 1959-02-03 Miller Adolph Metal plating bath
NL199518A (xx) * 1956-10-22
SU116447A1 (ru) * 1958-06-11 1958-11-30 А.М. Ямпольский Способ нанесени медных покрытий электролизом нецианистых электролитов
NL123240C (xx) * 1960-07-23
US3280736A (en) * 1964-06-08 1966-10-25 Metalgamica S A Multi-metal planographic printing plates

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195454A (en) * 1939-01-07 1940-04-02 Louis Weisberg Inc Electrodeposition of copper
BE767398A (fr) * 1970-05-25 1971-10-18 Canada Wire & Cable Co Ltd Procede de placage de cuivre sur de l'aluminium

Also Published As

Publication number Publication date
FR2159239B1 (xx) 1977-06-17
US3775264A (en) 1973-11-27
CA1001581A (en) 1976-12-14
GB1347936A (en) 1974-02-27
DE2249037A1 (de) 1973-05-17

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Legal Events

Date Code Title Description
ST Notification of lapse