FR2156407B1 - - Google Patents
Info
- Publication number
- FR2156407B1 FR2156407B1 FR7236788A FR7236788A FR2156407B1 FR 2156407 B1 FR2156407 B1 FR 2156407B1 FR 7236788 A FR7236788 A FR 7236788A FR 7236788 A FR7236788 A FR 7236788A FR 2156407 B1 FR2156407 B1 FR 2156407B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18911471A | 1971-10-14 | 1971-10-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2156407A1 FR2156407A1 (fr) | 1973-05-25 |
| FR2156407B1 true FR2156407B1 (fr) | 1974-10-25 |
Family
ID=22695991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7236788A Expired FR2156407B1 (fr) | 1971-10-14 | 1972-10-11 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3738882A (fr) |
| JP (1) | JPS5528417B2 (fr) |
| DE (1) | DE2249142C2 (fr) |
| FR (1) | FR2156407B1 (fr) |
| GB (1) | GB1364606A (fr) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2600990A1 (de) * | 1976-01-13 | 1977-07-21 | Wacker Chemitronic | Verfahren zum polieren von halbleiteroberflaechen, insbesondere galliumphosphidoberflaechen |
| US4343662A (en) * | 1981-03-31 | 1982-08-10 | Atlantic Richfield Company | Manufacturing semiconductor wafer devices by simultaneous slicing and etching |
| DE3222790A1 (de) * | 1982-06-18 | 1983-12-22 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum polieren von indiumphosphidoberflaechen |
| DE3237235C2 (de) * | 1982-10-07 | 1986-07-10 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum Polieren von III-V-Halbleiteroberflächen |
| DE3677735D1 (de) * | 1985-12-17 | 1991-04-04 | Max Planck Gesellschaft | Verfahren zur herstellung von halbleitersubstraten. |
| JPH0727881B2 (ja) * | 1986-06-10 | 1995-03-29 | 株式会社ジャパンエナジー | ＩｎＰウェーハの鏡面研磨液ならびに鏡面研磨方法 |
| JPH06101457B2 (ja) * | 1986-06-10 | 1994-12-12 | 株式会社ジャパンエナジー | ＧａＡｓウェーハの鏡面研磨液ならびに鏡面研磨方法 |
| JPH01253239A (ja) * | 1988-04-01 | 1989-10-09 | Mitsubishi Monsanto Chem Co | ＡｌＧａＡｓ表面研磨方法 |
| TW402542B (en) * | 1994-10-24 | 2000-08-21 | Motorola Inc | Improvements in timing and location for mixing polishing fluid in a process of polishing a semiconductor substrate |
| JP4759298B2 (ja) * | 2005-03-30 | 2011-08-31 | 株式会社フジミインコーポレーテッド | 単結晶表面用の研磨剤及び研磨方法 |
| JP5695963B2 (ja) * | 2011-04-28 | 2015-04-08 | 株式会社荏原製作所 | 研磨方法 |
| CN115056044A (zh) * | 2022-06-23 | 2022-09-16 | 浙江康鹏半导体有限公司 | 一种砷化镓衬底的表面处理方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3342652A (en) * | 1964-04-02 | 1967-09-19 | Ibm | Chemical polishing of a semi-conductor substrate |
-
1971
- 1971-10-14 US US00189114A patent/US3738882A/en not_active Expired - Lifetime
-
1972
- 1972-09-13 JP JP9135472A patent/JPS5528417B2/ja not_active Expired
- 1972-10-05 GB GB4590972A patent/GB1364606A/en not_active Expired
- 1972-10-06 DE DE2249142A patent/DE2249142C2/de not_active Expired
- 1972-10-11 FR FR7236788A patent/FR2156407B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4847766A (fr) | 1973-07-06 |
| DE2249142A1 (de) | 1973-04-19 |
| US3738882A (en) | 1973-06-12 |
| FR2156407A1 (fr) | 1973-05-25 |
| GB1364606A (en) | 1974-08-21 |
| DE2249142C2 (de) | 1983-05-19 |
| JPS5528417B2 (fr) | 1980-07-28 |