FR2150431B2 - - Google Patents
Info
- Publication number
- FR2150431B2 FR2150431B2 FR7229921A FR7229921A FR2150431B2 FR 2150431 B2 FR2150431 B2 FR 2150431B2 FR 7229921 A FR7229921 A FR 7229921A FR 7229921 A FR7229921 A FR 7229921A FR 2150431 B2 FR2150431 B2 FR 2150431B2
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17415771A | 1971-08-23 | 1971-08-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2150431A2 FR2150431A2 (enFirst) | 1973-04-06 |
| FR2150431B2 true FR2150431B2 (enFirst) | 1975-03-07 |
Family
ID=22635075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7229921A Expired FR2150431B2 (enFirst) | 1971-08-23 | 1972-08-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3728137A (enFirst) |
| BE (1) | BE787837R (enFirst) |
| ES (1) | ES405960A2 (enFirst) |
| FR (1) | FR2150431B2 (enFirst) |
| IT (1) | IT1044885B (enFirst) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4229218A (en) * | 1979-02-05 | 1980-10-21 | Shipley Company Inc. | Self-monitoring electroless plating solution |
| US4324589A (en) * | 1979-02-05 | 1982-04-13 | Shipley Company Inc. | Solute monitoring process |
| EP0109015A1 (en) * | 1982-11-15 | 1984-05-23 | Shipley Company Inc. | Electroless copper plating |
| US4539044A (en) * | 1982-11-15 | 1985-09-03 | Shipley Company Inc. | Electroless copper plating |
| US5120578A (en) * | 1990-05-31 | 1992-06-09 | Shipley Company Inc. | Coating composition |
| US5288313A (en) * | 1990-05-31 | 1994-02-22 | Shipley Company Inc. | Electroless plating catalyst |
| US5075039A (en) * | 1990-05-31 | 1991-12-24 | Shipley Company Inc. | Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
| US5626736A (en) | 1996-01-19 | 1997-05-06 | Shipley Company, L.L.C. | Electroplating process |
| AU5453200A (en) | 1999-06-09 | 2000-12-28 | Laird Technologies, Inc. | Electrically conductive polymeric foam and method of preparation thereof |
| JP2006093651A (ja) * | 2004-08-26 | 2006-04-06 | Ngk Spark Plug Co Ltd | 配線基板の製造方法および配線基板製造用無電解メッキ装置 |
-
1971
- 1971-08-23 US US00174157A patent/US3728137A/en not_active Expired - Lifetime
-
1972
- 1972-08-18 ES ES405960A patent/ES405960A2/es not_active Expired
- 1972-08-22 IT IT28379/72A patent/IT1044885B/it active
- 1972-08-22 FR FR7229921A patent/FR2150431B2/fr not_active Expired
- 1972-08-22 BE BE787837A patent/BE787837R/xx active
Also Published As
| Publication number | Publication date |
|---|---|
| BE787837R (fr) | 1972-12-18 |
| ES405960A2 (es) | 1975-09-16 |
| IT1044885B (it) | 1980-04-21 |
| FR2150431A2 (enFirst) | 1973-04-06 |
| US3728137A (en) | 1973-04-17 |