BE787837R - Solution aqueuse de depot chimique de - Google Patents

Solution aqueuse de depot chimique de

Info

Publication number
BE787837R
BE787837R BE787837A BE787837A BE787837R BE 787837 R BE787837 R BE 787837R BE 787837 A BE787837 A BE 787837A BE 787837 A BE787837 A BE 787837A BE 787837 R BE787837 R BE 787837R
Authority
BE
Belgium
Prior art keywords
aqueous chemical
chemical deposit
deposit solution
solution
aqueous
Prior art date
Application number
BE787837A
Other languages
English (en)
Inventor
M Gulla
O B Dutkewych
L H Shipley
Ch R Shipley
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co filed Critical Shipley Co
Application granted granted Critical
Publication of BE787837R publication Critical patent/BE787837R/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
BE787837A 1971-08-23 1972-08-22 Solution aqueuse de depot chimique de BE787837R (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17415771A 1971-08-23 1971-08-23

Publications (1)

Publication Number Publication Date
BE787837R true BE787837R (fr) 1972-12-18

Family

ID=22635075

Family Applications (1)

Application Number Title Priority Date Filing Date
BE787837A BE787837R (fr) 1971-08-23 1972-08-22 Solution aqueuse de depot chimique de

Country Status (5)

Country Link
US (1) US3728137A (fr)
BE (1) BE787837R (fr)
ES (1) ES405960A2 (fr)
FR (1) FR2150431B2 (fr)
IT (1) IT1044885B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
US4324589A (en) * 1979-02-05 1982-04-13 Shipley Company Inc. Solute monitoring process
EP0109015A1 (fr) * 1982-11-15 1984-05-23 Shipley Company Inc. Procédé de dépôt chimique de cuivre
US4539044A (en) * 1982-11-15 1985-09-03 Shipley Company Inc. Electroless copper plating
US5075039A (en) * 1990-05-31 1991-12-24 Shipley Company Inc. Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
WO2000075395A1 (fr) 1999-06-09 2000-12-14 Laird Technologies, Inc. Mousse polymere electroconductrice et son procede de fabrication
JP2006093651A (ja) * 2004-08-26 2006-04-06 Ngk Spark Plug Co Ltd 配線基板の製造方法および配線基板製造用無電解メッキ装置

Also Published As

Publication number Publication date
ES405960A2 (es) 1975-09-16
US3728137A (en) 1973-04-17
FR2150431B2 (fr) 1975-03-07
FR2150431A2 (fr) 1973-04-06
IT1044885B (it) 1980-04-21

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