FR2146492A1 - - Google Patents

Info

Publication number
FR2146492A1
FR2146492A1 FR7226448A FR7226448A FR2146492A1 FR 2146492 A1 FR2146492 A1 FR 2146492A1 FR 7226448 A FR7226448 A FR 7226448A FR 7226448 A FR7226448 A FR 7226448A FR 2146492 A1 FR2146492 A1 FR 2146492A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7226448A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Glass Works filed Critical Corning Glass Works
Publication of FR2146492A1 publication Critical patent/FR2146492A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7226448A 1971-07-21 1972-07-21 Withdrawn FR2146492A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/164,747 US3983458A (en) 1971-07-21 1971-07-21 Electrical device assembly and method

Publications (1)

Publication Number Publication Date
FR2146492A1 true FR2146492A1 (fr) 1973-03-02

Family

ID=22595923

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7226448A Withdrawn FR2146492A1 (fr) 1971-07-21 1972-07-21

Country Status (4)

Country Link
US (1) US3983458A (fr)
DE (1) DE2232928A1 (fr)
FR (1) FR2146492A1 (fr)
GB (1) GB1367038A (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328530A (en) * 1980-06-30 1982-05-04 International Business Machines Corporation Multiple layer, ceramic carrier for high switching speed VLSI chips
US4945399A (en) * 1986-09-30 1990-07-31 International Business Machines Corporation Electronic package with integrated distributed decoupling capacitors
US4744008A (en) * 1986-11-18 1988-05-10 International Business Machines Corporation Flexible film chip carrier with decoupling capacitors
US4878155A (en) * 1987-09-25 1989-10-31 Conley Larry R High speed discrete wire pin panel assembly with embedded capacitors
US5046953A (en) * 1990-05-25 1991-09-10 Hewlett-Packard Company Method and apparatus for mounting an integrated circuit on a printed circuit board
US6312972B1 (en) 1999-08-09 2001-11-06 International Business Machines Corporation Pre-bond encapsulation of area array terminated chip and wafer scale packages
US20090021871A1 (en) * 2001-10-04 2009-01-22 Ise Corporation Energy Storage Pack Having Overvoltage Protection and Method of Protection
US20090190273A1 (en) * 2001-10-04 2009-07-30 Ise Corporation Ultracapacitor Overvoltage Protection Circuit With Self Verification
US20060257725A1 (en) * 2001-10-04 2006-11-16 Ise Corporation Energy Storage Cell Support Separator System for a Multiple Cell Module and Method of Use
US20070020513A1 (en) * 2001-10-04 2007-01-25 Ise Corporation Energy Storage Cell Support Separator and Cooling System for a Multiple Cell Module
US7085112B2 (en) * 2001-10-04 2006-08-01 Ise Corporation High-power ultracapacitor energy storage pack and method of use
US7218489B2 (en) * 2001-10-04 2007-05-15 Ise Corporation High-power ultracapacitor energy storage pack and method of use
US20080068801A1 (en) * 2001-10-04 2008-03-20 Ise Corporation High-Power Ultracapacitor Energy Storage Cell Pack and Coupling Method
US6714391B2 (en) 2001-10-04 2004-03-30 Ise Research Corporation Ultracapacitor energy storage cell pack and methods of assembling and cooling the same
US20070002518A1 (en) * 2001-10-04 2007-01-04 Ise Corporation High-Power Ultracapacitor Energy Storage Pack and Method of Use
DE102007009671A1 (de) * 2007-02-28 2008-09-04 Hirschmann Automotive Gmbh Verfahren zum Ummanteln von mehreren Stanzgittern

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2586854A (en) * 1947-04-19 1952-02-26 Farnsworth Res Corp Printed circuit construction
US3142783A (en) * 1959-12-22 1964-07-28 Hughes Aircraft Co Electrical circuit system
US3134930A (en) * 1961-11-17 1964-05-26 Electro Optical Systems Inc Microminiature circuitry
US3192307A (en) * 1964-05-29 1965-06-29 Burndy Corp Connector for component and printed circuit board
GB1249108A (en) * 1967-10-02 1971-10-06 Electrosil Ltd Electric circuit assemblies
GB1266632A (fr) * 1969-06-18 1972-03-15

Also Published As

Publication number Publication date
US3983458A (en) 1976-09-28
DE2232928A1 (de) 1973-02-01
GB1367038A (en) 1974-09-18

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Legal Events

Date Code Title Description
ST Notification of lapse