FR2143734A1 - - Google Patents
Info
- Publication number
- FR2143734A1 FR2143734A1 FR7222679A FR7222679A FR2143734A1 FR 2143734 A1 FR2143734 A1 FR 2143734A1 FR 7222679 A FR7222679 A FR 7222679A FR 7222679 A FR7222679 A FR 7222679A FR 2143734 A1 FR2143734 A1 FR 2143734A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15858071A | 1971-06-30 | 1971-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2143734A1 true FR2143734A1 (cg-RX-API-DMAC10.html) | 1973-02-09 |
| FR2143734B1 FR2143734B1 (cg-RX-API-DMAC10.html) | 1974-07-26 |
Family
ID=22568791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR727222679A Expired FR2143734B1 (cg-RX-API-DMAC10.html) | 1971-06-30 | 1972-06-20 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3791027A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2231299A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2143734B1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1374008A (cg-RX-API-DMAC10.html) |
| IT (1) | IT959648B (cg-RX-API-DMAC10.html) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0073811A4 (en) * | 1981-03-16 | 1984-09-13 | Motorola Inc | PERMANENT FONDANT AGENT AND THROUGH WELDING CONFORMATION COATING. |
| EP0381468A1 (en) * | 1989-01-31 | 1990-08-08 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
| EP0413312A1 (en) * | 1989-08-16 | 1991-02-20 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| EP0488398A3 (en) * | 1990-11-30 | 1992-10-21 | Nippondenso Co., Ltd. | Soldering flux composition |
| EP0443030A4 (en) * | 1989-08-08 | 1993-07-07 | Nippondenso Co., Ltd. | Soldering flux |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2292375A1 (fr) * | 1974-11-21 | 1976-06-18 | Inst Nat Sante Rech Med | Generateur d'impulsions de frequences audibles |
| US4216035A (en) * | 1977-12-23 | 1980-08-05 | International Business Machines Corporation | Removable protective coating and process of using same |
| US4504007A (en) * | 1982-09-14 | 1985-03-12 | International Business Machines Corporation | Solder and braze fluxes and processes for using the same |
| US4547304A (en) * | 1984-08-30 | 1985-10-15 | Texaco, Inc. | Nonfuming solder cleansing and fusing fluids |
| US5145722A (en) * | 1989-04-11 | 1992-09-08 | Hughes Aircraft Company | Method and composition for protecting and enhancing the solderability of metallic surfaces |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| WO1992005228A1 (en) * | 1990-09-17 | 1992-04-02 | Motorola, Inc. | Solder pastes containing acrylic acid and derivatives thereof |
| GB2287253B (en) * | 1992-03-19 | 1996-04-03 | Fujitsu Ltd | Removal of oxide film from a metal |
| GB2265156B (en) * | 1992-03-19 | 1996-04-03 | Fujitsu Ltd | Methods for making metal particles spherical and removing oxide film therefrom |
| CA2221961C (en) * | 1995-05-24 | 2008-02-05 | Fry's Metals Inc. | Epoxy-based, voc-free soldering flux |
| US7041771B1 (en) * | 1995-08-11 | 2006-05-09 | Kac Holdings, Inc. | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
| JP3378139B2 (ja) * | 1996-03-19 | 2003-02-17 | 株式会社デンソー | はんだ付け用のフラックス |
| US5851311A (en) * | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
| US6449834B1 (en) * | 1997-05-02 | 2002-09-17 | Scilogy Corp. | Electrical conductor coils and methods of making same |
| US6367150B1 (en) | 1997-09-05 | 2002-04-09 | Northrop Grumman Corporation | Solder flux compatible with flip-chip underfill material |
| US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
| MY139328A (en) * | 2002-05-20 | 2009-09-30 | Nitto Denko Corp | Thermosetting resin composition and semiconductor device obtained with the same |
| JP3952189B2 (ja) * | 2003-02-06 | 2007-08-01 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
| DE102005053553A1 (de) | 2005-11-08 | 2007-05-16 | Heraeus Gmbh W C | Lotpasten mit harzfreien Flussmittel |
| CN103548430B (zh) * | 2011-06-02 | 2016-12-28 | 松下知识产权经营株式会社 | 电子部件安装方法、电子部件搭载装置以及电子部件安装系统 |
| JP2017527102A (ja) * | 2014-06-19 | 2017-09-14 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッドAlpha Assembly Solutions Inc. | 工業用残渣はんだペースト技術 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2833030A (en) * | 1952-09-19 | 1958-05-06 | Wall Colmonoy Corp | Method of joining metal parts with flexible composite joining material |
| US2816357A (en) * | 1953-08-27 | 1957-12-17 | Bjorksten Res Lab Inc | Method of soldering with a polyester flux |
| US3035339A (en) * | 1957-08-12 | 1962-05-22 | Gen Motors Corp | Method of soldering and flux therefor |
| US3119179A (en) * | 1958-03-10 | 1964-01-28 | Mccord Corp | Soldering flux and method |
| US3040781A (en) * | 1958-04-15 | 1962-06-26 | Martin Marietta Corp | Solderable coating |
| US3376150A (en) * | 1964-09-11 | 1968-04-02 | Du Pont | Imide and polyimide solutions |
| US3264146A (en) * | 1965-09-10 | 1966-08-02 | Continental Can Co | Organic flux compositions and method of using same |
| US3507828A (en) * | 1966-03-09 | 1970-04-21 | Mobil Chem Co | Thermosetting resin made by reaction of epoxy copolymer with polyfunctional amine and then with aldehyde |
| US3436278A (en) * | 1966-08-08 | 1969-04-01 | Ibm | Glycol soldering fluxes |
| US3513125A (en) * | 1967-02-24 | 1970-05-19 | Grace W R & Co | Carbazate crosslinking agent and thermosetting resin compositions and process of making same |
| US3488831A (en) * | 1967-04-14 | 1970-01-13 | Continental Can Co | Fluxing materials for soldering metal surfaces |
| US3655461A (en) * | 1970-09-02 | 1972-04-11 | Sanyo Electric Works | Flux for aluminum soldering |
-
1971
- 1971-06-30 US US00158580A patent/US3791027A/en not_active Expired - Lifetime
-
1972
- 1972-04-26 IT IT23518/72A patent/IT959648B/it active
- 1972-05-31 GB GB2535672A patent/GB1374008A/en not_active Expired
- 1972-06-20 FR FR727222679A patent/FR2143734B1/fr not_active Expired
- 1972-06-26 DE DE2231299A patent/DE2231299A1/de active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0073811A4 (en) * | 1981-03-16 | 1984-09-13 | Motorola Inc | PERMANENT FONDANT AGENT AND THROUGH WELDING CONFORMATION COATING. |
| EP0381468A1 (en) * | 1989-01-31 | 1990-08-08 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
| EP0443030A4 (en) * | 1989-08-08 | 1993-07-07 | Nippondenso Co., Ltd. | Soldering flux |
| EP0413312A1 (en) * | 1989-08-16 | 1991-02-20 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| EP0488398A3 (en) * | 1990-11-30 | 1992-10-21 | Nippondenso Co., Ltd. | Soldering flux composition |
| US5211763A (en) * | 1990-11-30 | 1993-05-18 | Nippondenso Co., Ltd. | Soldering flux composition |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2231299A1 (de) | 1973-01-11 |
| GB1374008A (en) | 1974-11-13 |
| IT959648B (it) | 1973-11-10 |
| US3791027A (en) | 1974-02-12 |
| FR2143734B1 (cg-RX-API-DMAC10.html) | 1974-07-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |