FR2140453A1 - - Google Patents

Info

Publication number
FR2140453A1
FR2140453A1 FR7220157A FR7220157A FR2140453A1 FR 2140453 A1 FR2140453 A1 FR 2140453A1 FR 7220157 A FR7220157 A FR 7220157A FR 7220157 A FR7220157 A FR 7220157A FR 2140453 A1 FR2140453 A1 FR 2140453A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7220157A
Other languages
French (fr)
Other versions
FR2140453B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Nederland BV
Original Assignee
Thales Nederland BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Nederland BV filed Critical Thales Nederland BV
Publication of FR2140453A1 publication Critical patent/FR2140453A1/fr
Application granted granted Critical
Publication of FR2140453B1 publication Critical patent/FR2140453B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607—Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7220157A 1971-06-07 1972-06-05 Expired FR2140453B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7107750.A NL166171C (en) 1971-06-07 1971-06-07 METHOD FOR MANUFACTURING MULTIPLE LAYER PRINTED CIRCUITS AND DEVICE FOR REALIZING THIS METHOD

Publications (2)

Publication Number Publication Date
FR2140453A1 true FR2140453A1 (en) 1973-01-19
FR2140453B1 FR2140453B1 (en) 1977-12-23

Family

ID=19813317

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7220157A Expired FR2140453B1 (en) 1971-06-07 1972-06-05

Country Status (11)

Country Link
JP (1) JPS5615156B1 (en)
AU (1) AU469693B2 (en)
BE (1) BE784154A (en)
CA (1) CA970075A (en)
CH (1) CH537139A (en)
DE (1) DE2226430C3 (en)
FR (1) FR2140453B1 (en)
GB (1) GB1367737A (en)
IT (1) IT960854B (en)
NL (1) NL166171C (en)
SE (1) SE378973B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046978A2 (en) * 1980-09-02 1982-03-10 Robert Bürkle GmbH & Co. Method of making multilayer circuit boards, and apparatus therefor
FR2586251A1 (en) * 1985-08-16 1987-02-20 Burr Brown Corp METHOD FOR CONNECTING PLANED SURFACES BY USING PASTY STATE ADHESIVE SUBSTANCES OR IN THE FORM OF NON-DRY FILM

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
DE3027336A1 (en) * 1980-07-18 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Through hole insulation - for metal core printed circuit board, by evacuation, heating and pressure application
JPS57196598A (en) * 1981-05-29 1982-12-02 Hitachi Ltd Method of producing multilayer printed board
CA1283591C (en) * 1985-08-26 1991-04-30 Theron L. Ellis Method for making a flush surface laminate for a multilayer circuit board
CA1256502A (en) * 1986-05-28 1989-06-27 Reinhold Henke Low rf emission fiber optic transmission system
JPH03121379A (en) * 1989-09-30 1991-05-23 Matsushita Electric Ind Co Ltd Flow control device
JP2824180B2 (en) * 1993-02-03 1998-11-11 ローム株式会社 Heating press equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046978A2 (en) * 1980-09-02 1982-03-10 Robert Bürkle GmbH & Co. Method of making multilayer circuit boards, and apparatus therefor
EP0046978A3 (en) * 1980-09-02 1983-06-01 Robert Bürkle GmbH & Co. Method of making multilayer circuit boards, and apparatus therefor
FR2586251A1 (en) * 1985-08-16 1987-02-20 Burr Brown Corp METHOD FOR CONNECTING PLANED SURFACES BY USING PASTY STATE ADHESIVE SUBSTANCES OR IN THE FORM OF NON-DRY FILM

Also Published As

Publication number Publication date
AU4295072A (en) 1973-12-06
IT960854B (en) 1973-11-30
SE378973B (en) 1975-09-15
GB1367737A (en) 1974-09-25
DE2226430B2 (en) 1977-09-15
AU469693B2 (en) 1973-12-06
DE2226430A1 (en) 1973-01-11
BE784154A (en) 1972-09-18
FR2140453B1 (en) 1977-12-23
JPS5615156B1 (en) 1981-04-08
DE2226430C3 (en) 1978-05-11
NL166171B (en) 1981-01-15
CA970075A (en) 1975-06-24
NL7107750A (en) 1972-12-11
CH537139A (en) 1973-05-15
NL166171C (en) 1981-01-15

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Legal Events

Date Code Title Description
CD Change of name or company name
ST Notification of lapse