AU469693B2 - Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method - Google Patents

Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method

Info

Publication number
AU469693B2
AU469693B2 AU42950/72A AU4295072A AU469693B2 AU 469693 B2 AU469693 B2 AU 469693B2 AU 42950/72 A AU42950/72 A AU 42950/72A AU 4295072 A AU4295072 A AU 4295072A AU 469693 B2 AU469693 B2 AU 469693B2
Authority
AU
Australia
Prior art keywords
forthe
realisation
multiple layers
fabrication
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU42950/72A
Other versions
AU4295072A (en
Inventor
La Roy And Erik Adriaan Willem Van Rabenhorst Tengbergen Dick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Nederland BV
Original Assignee
Thales Nederland BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Nederland BV filed Critical Thales Nederland BV
Application granted granted Critical
Publication of AU4295072A publication Critical patent/AU4295072A/en
Publication of AU469693B2 publication Critical patent/AU469693B2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00Shaping characteristics in general
    • B29C2791/004Shaping under special conditions
    • B29C2791/006Using vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/40Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60In a particular environment
    • B32B2309/68Vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
AU42950/72A 1971-06-07 1972-05-31 Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method Expired AU469693B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NLNL7107750 1971-06-07
NL7107750.A NL166171C (en) 1971-06-07 1971-06-07 METHOD FOR MANUFACTURING MULTIPLE LAYER PRINTED CIRCUITS AND DEVICE FOR REALIZING THIS METHOD

Publications (2)

Publication Number Publication Date
AU4295072A AU4295072A (en) 1973-12-06
AU469693B2 true AU469693B2 (en) 1973-12-06

Family

ID=19813317

Family Applications (1)

Application Number Title Priority Date Filing Date
AU42950/72A Expired AU469693B2 (en) 1971-06-07 1972-05-31 Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method

Country Status (11)

Country Link
JP (1) JPS5615156B1 (en)
AU (1) AU469693B2 (en)
BE (1) BE784154A (en)
CA (1) CA970075A (en)
CH (1) CH537139A (en)
DE (1) DE2226430C3 (en)
FR (1) FR2140453B1 (en)
GB (1) GB1367737A (en)
IT (1) IT960854B (en)
NL (1) NL166171C (en)
SE (1) SE378973B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU599652B2 (en) * 1986-05-28 1990-07-26 Adc Telecommunications, Incorporated Low RF emission fiber optic transmission system

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
DE3027336A1 (en) * 1980-07-18 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Through hole insulation - for metal core printed circuit board, by evacuation, heating and pressure application
DE3032931C2 (en) * 1980-09-02 1982-07-29 Robert Bürkle GmbH & Co, 7290 Freudenstadt Method and arrangement for the production of multilayer printed circuit boards
JPS57196598A (en) * 1981-05-29 1982-12-02 Hitachi Ltd Method of producing multilayer printed board
JPS6239681A (en) * 1985-08-16 1987-02-20 バア−−ブラウン コ−ポレ−シヨン Bonding method using pasty or non-dry film adhesive
CA1283591C (en) * 1985-08-26 1991-04-30 Theron L. Ellis Method for making a flush surface laminate for a multilayer circuit board
JPH03121379A (en) * 1989-09-30 1991-05-23 Matsushita Electric Ind Co Ltd Flow control device
JP2824180B2 (en) * 1993-02-03 1998-11-11 ローム株式会社 Heating press equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU599652B2 (en) * 1986-05-28 1990-07-26 Adc Telecommunications, Incorporated Low RF emission fiber optic transmission system

Also Published As

Publication number Publication date
NL7107750A (en) 1972-12-11
AU4295072A (en) 1973-12-06
NL166171C (en) 1981-01-15
GB1367737A (en) 1974-09-25
NL166171B (en) 1981-01-15
DE2226430B2 (en) 1977-09-15
SE378973B (en) 1975-09-15
CH537139A (en) 1973-05-15
BE784154A (en) 1972-09-18
JPS5615156B1 (en) 1981-04-08
DE2226430C3 (en) 1978-05-11
CA970075A (en) 1975-06-24
FR2140453B1 (en) 1977-12-23
IT960854B (en) 1973-11-30
FR2140453A1 (en) 1973-01-19
DE2226430A1 (en) 1973-01-11

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