FR2115206B2 - - Google Patents

Info

Publication number
FR2115206B2
FR2115206B2 FR7141084A FR7141084A FR2115206B2 FR 2115206 B2 FR2115206 B2 FR 2115206B2 FR 7141084 A FR7141084 A FR 7141084A FR 7141084 A FR7141084 A FR 7141084A FR 2115206 B2 FR2115206 B2 FR 2115206B2
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7141084A
Other languages
French (fr)
Other versions
FR2115206A2 (OSRAM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2023680A external-priority patent/DE2023680C3/de
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2115206A2 publication Critical patent/FR2115206A2/fr
Application granted granted Critical
Publication of FR2115206B2 publication Critical patent/FR2115206B2/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W70/466
    • H10P72/0446
    • H10W76/161
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01075Rhenium [Re]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
FR7141084A 1970-05-14 1971-11-17 Expired FR2115206B2 (OSRAM)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2023680A DE2023680C3 (de) 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben
DE2057126A DE2057126C3 (de) 1970-05-14 1970-11-20 Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen

Publications (2)

Publication Number Publication Date
FR2115206A2 FR2115206A2 (OSRAM) 1972-07-07
FR2115206B2 true FR2115206B2 (OSRAM) 1977-11-25

Family

ID=34227360

Family Applications (2)

Application Number Title Priority Date Filing Date
FR7117480A Expired FR2088564B1 (OSRAM) 1970-05-14 1971-05-14
FR7141084A Expired FR2115206B2 (OSRAM) 1970-05-14 1971-11-17

Family Applications Before (1)

Application Number Title Priority Date Filing Date
FR7117480A Expired FR2088564B1 (OSRAM) 1970-05-14 1971-05-14

Country Status (3)

Country Link
DE (1) DE2057126C3 (OSRAM)
FR (2) FR2088564B1 (OSRAM)
NL (1) NL7115991A (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58108761A (ja) * 1981-12-23 1983-06-28 Toshiba Corp 電子部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
FR1534329A (fr) * 1966-08-16 1968-07-26 Signetics Corp Procédé de montage de circuits intégrés
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays
DE1915501C3 (de) * 1969-03-26 1975-10-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen
DE1917399A1 (de) * 1969-04-03 1970-10-08 Siemens Ag Anordnung mit wenigstens zwei elektrische Schaltelemente oder integrierte elektrische Schaltungen enthaltenden Halbleiterkoerpern

Also Published As

Publication number Publication date
NL7115991A (OSRAM) 1972-05-24
FR2088564B1 (OSRAM) 1977-08-05
DE2057126B2 (de) 1975-03-27
FR2115206A2 (OSRAM) 1972-07-07
FR2088564A1 (OSRAM) 1972-01-07
DE2057126A1 (de) 1972-05-25
DE2057126C3 (de) 1975-11-06

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