FR2115206A2 - - Google Patents
Info
- Publication number
- FR2115206A2 FR2115206A2 FR7141084A FR7141084A FR2115206A2 FR 2115206 A2 FR2115206 A2 FR 2115206A2 FR 7141084 A FR7141084 A FR 7141084A FR 7141084 A FR7141084 A FR 7141084A FR 2115206 A2 FR2115206 A2 FR 2115206A2
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/466—Tape carriers or flat leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2023680A DE2023680C3 (de) | 1970-05-14 | 1970-05-14 | Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben |
| DE2057126A DE2057126C3 (de) | 1970-05-14 | 1970-11-20 | Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2115206A2 true FR2115206A2 (https=) | 1972-07-07 |
| FR2115206B2 FR2115206B2 (https=) | 1977-11-25 |
Family
ID=34227360
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7117480A Expired FR2088564B1 (https=) | 1970-05-14 | 1971-05-14 | |
| FR7141084A Expired FR2115206B2 (https=) | 1970-05-14 | 1971-11-17 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7117480A Expired FR2088564B1 (https=) | 1970-05-14 | 1971-05-14 |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE2057126C3 (https=) |
| FR (2) | FR2088564B1 (https=) |
| NL (1) | NL7115991A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0084161A3 (en) * | 1981-12-23 | 1985-05-15 | Kabushiki Kaisha Toshiba | Lead frames for electronic and electric devices |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614832A (en) * | 1966-03-09 | 1971-10-26 | Ibm | Decal connectors and methods of forming decal connections to solid state devices |
| FR1534329A (fr) * | 1966-08-16 | 1968-07-26 | Signetics Corp | Procédé de montage de circuits intégrés |
| US3486223A (en) * | 1967-04-27 | 1969-12-30 | Philco Ford Corp | Solder bonding |
| US3474297A (en) * | 1967-06-30 | 1969-10-21 | Texas Instruments Inc | Interconnection system for complex semiconductor arrays |
| DE1915501C3 (de) * | 1969-03-26 | 1975-10-16 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen |
| DE1917399A1 (de) * | 1969-04-03 | 1970-10-08 | Siemens Ag | Anordnung mit wenigstens zwei elektrische Schaltelemente oder integrierte elektrische Schaltungen enthaltenden Halbleiterkoerpern |
-
1970
- 1970-11-20 DE DE2057126A patent/DE2057126C3/de not_active Expired
-
1971
- 1971-05-14 FR FR7117480A patent/FR2088564B1/fr not_active Expired
- 1971-11-17 FR FR7141084A patent/FR2115206B2/fr not_active Expired
- 1971-11-19 NL NL7115991A patent/NL7115991A/xx unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0084161A3 (en) * | 1981-12-23 | 1985-05-15 | Kabushiki Kaisha Toshiba | Lead frames for electronic and electric devices |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2057126A1 (de) | 1972-05-25 |
| FR2115206B2 (https=) | 1977-11-25 |
| DE2057126B2 (de) | 1975-03-27 |
| FR2088564A1 (https=) | 1972-01-07 |
| NL7115991A (https=) | 1972-05-24 |
| DE2057126C3 (de) | 1975-11-06 |
| FR2088564B1 (https=) | 1977-08-05 |