FR2101204A1 - - Google Patents

Info

Publication number
FR2101204A1
FR2101204A1 FR7128454A FR7128454A FR2101204A1 FR 2101204 A1 FR2101204 A1 FR 2101204A1 FR 7128454 A FR7128454 A FR 7128454A FR 7128454 A FR7128454 A FR 7128454A FR 2101204 A1 FR2101204 A1 FR 2101204A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7128454A
Other languages
French (fr)
Other versions
FR2101204B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of FR2101204A1 publication Critical patent/FR2101204A1/fr
Application granted granted Critical
Publication of FR2101204B1 publication Critical patent/FR2101204B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10P72/0446—
    • H10W70/04—
    • H10W70/442—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
FR7128454A 1970-08-03 1971-08-03 Expired FR2101204B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6034070A 1970-08-03 1970-08-03

Publications (2)

Publication Number Publication Date
FR2101204A1 true FR2101204A1 (enExample) 1972-03-31
FR2101204B1 FR2101204B1 (enExample) 1974-04-26

Family

ID=22028893

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7128454A Expired FR2101204B1 (enExample) 1970-08-03 1971-08-03

Country Status (5)

Country Link
US (1) US3698076A (enExample)
BE (1) BE770897A (enExample)
DE (1) DE2138797A1 (enExample)
FR (1) FR2101204B1 (enExample)
NL (1) NL7110657A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2156156A1 (enExample) * 1971-10-08 1973-05-25 Plessey Micro Science
WO2022171938A1 (fr) 2021-02-09 2022-08-18 Psa Automobiles Sa Dispositif et procédé de contrôle de la configuration d'une batterie modulaire pour éviter des situations dangereuses

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US4063993A (en) * 1975-07-07 1977-12-20 National Semiconductor Corporation Method of making gang bonding interconnect tape for semiconductive devices
JPS5326670A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Manufacture of semiconductor device
DE2840973A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung pruefbarer halbleiter-miniaturgehaeuse in bandform
DE3104623A1 (de) * 1981-02-10 1982-08-26 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum befestigen von bauelementen mit flaechigen anschlusskontakten und bauelement hierfuer
DE3336606A1 (de) * 1983-10-07 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur mikropackherstellung
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
US7169643B1 (en) * 1998-12-28 2007-01-30 Seiko Epson Corporation Semiconductor device, method of fabricating the same, circuit board, and electronic apparatus
JP2002016181A (ja) * 2000-04-25 2002-01-18 Torex Semiconductor Ltd 半導体装置、その製造方法、及び電着フレーム
MY130826A (en) * 2001-07-25 2007-07-31 Integrated Device Tech Lead formation, assembly strip test, and singulation method and system
US6720786B2 (en) 2001-07-25 2004-04-13 Integrated Device Technology, Inc. Lead formation, assembly strip test, and singulation system
JP4760899B2 (ja) * 2008-12-12 2011-08-31 株式会社村田製作所 チップ状電子部品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3024151A (en) * 1957-09-30 1962-03-06 Automated Circuits Inc Printed electrical circuits and method of making the same
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3371148A (en) * 1966-04-12 1968-02-27 Radiation Inc Semiconductor device package and method of assembly therefor
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
NL6608701A (enExample) * 1966-06-23 1967-12-27
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3428933A (en) * 1966-08-29 1969-02-18 Automation Ind Inc Strain gage unit and method of applying the gage
US3469684A (en) * 1967-01-26 1969-09-30 Advalloy Inc Lead frame package for semiconductor devices and method for making same
US3550945A (en) * 1968-09-19 1970-12-29 Fred Bronner Corp Jigsaw puzzle and base for retaining same
US3608711A (en) * 1969-10-06 1971-09-28 Teledyne Inc Package for electronic devices and the like

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2156156A1 (enExample) * 1971-10-08 1973-05-25 Plessey Micro Science
WO2022171938A1 (fr) 2021-02-09 2022-08-18 Psa Automobiles Sa Dispositif et procédé de contrôle de la configuration d'une batterie modulaire pour éviter des situations dangereuses

Also Published As

Publication number Publication date
FR2101204B1 (enExample) 1974-04-26
DE2138797A1 (de) 1972-02-24
US3698076A (en) 1972-10-17
BE770897A (fr) 1972-02-03
NL7110657A (enExample) 1972-02-07

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Legal Events

Date Code Title Description
ST Notification of lapse