FR2090206A1 - - Google Patents

Info

Publication number
FR2090206A1
FR2090206A1 FR7118100A FR7118100A FR2090206A1 FR 2090206 A1 FR2090206 A1 FR 2090206A1 FR 7118100 A FR7118100 A FR 7118100A FR 7118100 A FR7118100 A FR 7118100A FR 2090206 A1 FR2090206 A1 FR 2090206A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7118100A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2090206A1 publication Critical patent/FR2090206A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)
FR7118100A 1970-05-22 1971-05-19 Withdrawn FR2090206A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3965070A 1970-05-22 1970-05-22

Publications (1)

Publication Number Publication Date
FR2090206A1 true FR2090206A1 (ja) 1972-01-14

Family

ID=21906611

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7118100A Withdrawn FR2090206A1 (ja) 1970-05-22 1971-05-19

Country Status (4)

Country Link
DE (2) DE7119711U (ja)
FR (1) FR2090206A1 (ja)
GB (1) GB1356157A (ja)
IE (1) IE35063B1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508469A (ja) * 1973-05-21 1975-01-28
FR2320634A1 (fr) * 1975-08-04 1977-03-04 Gen Electric Element semi-conducteur ayant une couche polymere de protection
FR2335960A1 (fr) * 1975-12-18 1977-07-15 Gen Electric Element semi-conducteur perfectionne
EP0491389A1 (de) * 1990-12-19 1992-06-24 Siemens Aktiengesellschaft Leistungshalbleiterbauelement

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009017732A1 (de) * 2009-04-11 2010-10-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleiterbauelement mit einer Randpassivierung und Verfahren zu dessen Herstellung
CN104124215B (zh) * 2014-06-26 2017-02-15 江苏省宜兴电子器件总厂 一种焊接、键合和密封同步完成的封装结构和封装工艺

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508469A (ja) * 1973-05-21 1975-01-28
JPS5754043B2 (ja) * 1973-05-21 1982-11-16
FR2320634A1 (fr) * 1975-08-04 1977-03-04 Gen Electric Element semi-conducteur ayant une couche polymere de protection
FR2335960A1 (fr) * 1975-12-18 1977-07-15 Gen Electric Element semi-conducteur perfectionne
EP0491389A1 (de) * 1990-12-19 1992-06-24 Siemens Aktiengesellschaft Leistungshalbleiterbauelement

Also Published As

Publication number Publication date
DE7119711U (de) 1972-02-03
DE2125106A1 (de) 1971-12-02
IE35063L (en) 1971-11-22
IE35063B1 (en) 1975-10-29
GB1356157A (en) 1974-06-12

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Legal Events

Date Code Title Description
ST Notification of lapse