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1972-08-18 |
1977-01-04 |
Hitachi, Ltd. |
Isolating protective film for semiconductor devices and method for making the same
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1972-10-18 |
1977-04-12 |
Hitachi, Ltd. |
Discrete semiconductor device having polymer resin as insulator and method for making the same
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1973-08-02 |
1975-10-28 |
Texas Instruments Inc |
Extruded epoxy packaging system
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1977-06-13 |
1979-11-06 |
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1977-11-18 |
1983-10-20 |
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1978-11-07 |
1980-10-28 |
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Encapsulating moisture-proof coating
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Electrophotographic plate
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1982-10-15 |
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Werkwijze voor de fotolithografische behandeling van een substraat.
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1983-12-27 |
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Philips Nv |
Methode voor het aanbrengen van een metaalspiegel.
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1984-03-22 |
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Adhesion promoting product and process for treating an integrated circuit substrate therewith
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1986-09-17 |
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Adhesion promoting product and process for treating an integrated circuit substrate
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Producing integrated circuit chips with reduced stress effects
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1988-03-23 |
1991-03-26 |
The Dow Chemical Company |
Adhesion methods employing benzocyclobutene-based organosilane adhesion aids
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1989-07-20 |
1991-01-25 |
Snecma |
Procede de fabrication de moules-carapaces pour fonderie
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1994-11-29 |
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Method of adhering substrates
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1994-09-12 |
1996-03-14 |
Telefunken Microelectron |
Verfahren zur Reduzierung der Oberflächenrekombinationsgeschwindigkeit in Silizium
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1996-09-20 |
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1997-05-12 |
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International Business Machines Corporation |
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1997-09-19 |
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