FR2088564A1 - - Google Patents
Info
- Publication number
- FR2088564A1 FR2088564A1 FR7117480A FR7117480A FR2088564A1 FR 2088564 A1 FR2088564 A1 FR 2088564A1 FR 7117480 A FR7117480 A FR 7117480A FR 7117480 A FR7117480 A FR 7117480A FR 2088564 A1 FR2088564 A1 FR 2088564A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19702023680 DE2023680C3 (de) | 1970-05-14 | 1970-05-14 | Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben |
DE19702057126 DE2057126C3 (de) | 1970-05-14 | 1970-11-20 | Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2088564A1 true FR2088564A1 (de) | 1972-01-07 |
FR2088564B1 FR2088564B1 (de) | 1977-08-05 |
Family
ID=34227360
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7117480A Expired FR2088564B1 (de) | 1970-05-14 | 1971-05-14 | |
FR7141084A Expired FR2115206B2 (de) | 1970-05-14 | 1971-11-17 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7141084A Expired FR2115206B2 (de) | 1970-05-14 | 1971-11-17 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2057126C3 (de) |
FR (2) | FR2088564B1 (de) |
NL (1) | NL7115991A (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58108761A (ja) * | 1981-12-23 | 1983-06-28 | Toshiba Corp | 電子部品 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6703605A (de) * | 1966-03-09 | 1967-09-11 | ||
FR1534329A (fr) * | 1966-08-16 | 1968-07-26 | Signetics Corp | Procédé de montage de circuits intégrés |
NL6808931A (de) * | 1967-06-30 | 1968-12-31 | ||
US3486223A (en) * | 1967-04-27 | 1969-12-30 | Philco Ford Corp | Solder bonding |
DE1917399A1 (de) * | 1969-04-03 | 1970-10-08 | Siemens Ag | Anordnung mit wenigstens zwei elektrische Schaltelemente oder integrierte elektrische Schaltungen enthaltenden Halbleiterkoerpern |
FR2039895A5 (de) * | 1969-03-26 | 1971-01-15 | Siemens Ag |
-
1970
- 1970-11-20 DE DE19702057126 patent/DE2057126C3/de not_active Expired
-
1971
- 1971-05-14 FR FR7117480A patent/FR2088564B1/fr not_active Expired
- 1971-11-17 FR FR7141084A patent/FR2115206B2/fr not_active Expired
- 1971-11-19 NL NL7115991A patent/NL7115991A/xx unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6703605A (de) * | 1966-03-09 | 1967-09-11 | ||
FR1534329A (fr) * | 1966-08-16 | 1968-07-26 | Signetics Corp | Procédé de montage de circuits intégrés |
US3486223A (en) * | 1967-04-27 | 1969-12-30 | Philco Ford Corp | Solder bonding |
NL6808931A (de) * | 1967-06-30 | 1968-12-31 | ||
FR2039895A5 (de) * | 1969-03-26 | 1971-01-15 | Siemens Ag | |
DE1917399A1 (de) * | 1969-04-03 | 1970-10-08 | Siemens Ag | Anordnung mit wenigstens zwei elektrische Schaltelemente oder integrierte elektrische Schaltungen enthaltenden Halbleiterkoerpern |
Also Published As
Publication number | Publication date |
---|---|
DE2057126B2 (de) | 1975-03-27 |
NL7115991A (de) | 1972-05-24 |
FR2115206B2 (de) | 1977-11-25 |
DE2057126C3 (de) | 1975-11-06 |
DE2057126A1 (de) | 1972-05-25 |
FR2115206A2 (de) | 1972-07-07 |
FR2088564B1 (de) | 1977-08-05 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |