FR2079196A1 - - Google Patents

Info

Publication number
FR2079196A1
FR2079196A1 FR7103493A FR7103493A FR2079196A1 FR 2079196 A1 FR2079196 A1 FR 2079196A1 FR 7103493 A FR7103493 A FR 7103493A FR 7103493 A FR7103493 A FR 7103493A FR 2079196 A1 FR2079196 A1 FR 2079196A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7103493A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2079196A1 publication Critical patent/FR2079196A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thyristors (AREA)
FR7103493A 1970-02-02 1971-02-02 Withdrawn FR2079196A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US745370A 1970-02-02 1970-02-02

Publications (1)

Publication Number Publication Date
FR2079196A1 true FR2079196A1 (de) 1971-11-12

Family

ID=21726248

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7103493A Withdrawn FR2079196A1 (de) 1970-02-02 1971-02-02

Country Status (5)

Country Link
DE (2) DE2104726A1 (de)
FR (1) FR2079196A1 (de)
GB (1) GB1349478A (de)
IE (1) IE34925B1 (de)
SE (1) SE372847B (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2412168A1 (fr) * 1977-12-15 1979-07-13 Silicium Semiconducteur Ssc Diodes ecreteuses de surtension
WO1979000814A1 (en) * 1978-03-23 1979-10-18 Bbc Brown Boveri & Cie Semiconductor device comprising two semiconductor elements
WO1979000817A1 (fr) * 1978-03-23 1979-10-18 Bbc Brown Boveri & Cie Dispositif semi-conducteur comprenant au moins deux elements semi-conducteurs
EP0441572A2 (de) * 1990-02-07 1991-08-14 Ngk Insulators, Ltd. Leistungshalbleiter mit wärmeableitenden Eigenschaften
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
EP1670056A2 (de) * 2004-12-08 2006-06-14 Semikron Elektronik GmbH & Co. KG Patentabteilung Leistungshalbleitermodul mit Hilfsanschluss

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
JP2845739B2 (ja) * 1993-11-29 1999-01-13 三菱電機株式会社 圧接型半導体装置及びその製造方法
DE102009034138B4 (de) * 2009-07-22 2011-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2412168A1 (fr) * 1977-12-15 1979-07-13 Silicium Semiconducteur Ssc Diodes ecreteuses de surtension
WO1979000814A1 (en) * 1978-03-23 1979-10-18 Bbc Brown Boveri & Cie Semiconductor device comprising two semiconductor elements
WO1979000817A1 (fr) * 1978-03-23 1979-10-18 Bbc Brown Boveri & Cie Dispositif semi-conducteur comprenant au moins deux elements semi-conducteurs
EP0441572A2 (de) * 1990-02-07 1991-08-14 Ngk Insulators, Ltd. Leistungshalbleiter mit wärmeableitenden Eigenschaften
EP0441572A3 (en) * 1990-02-07 1992-07-15 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
EP1670056A2 (de) * 2004-12-08 2006-06-14 Semikron Elektronik GmbH & Co. KG Patentabteilung Leistungshalbleitermodul mit Hilfsanschluss
EP1670056A3 (de) * 2004-12-08 2009-03-11 Semikron Elektronik GmbH & Co. KG Patentabteilung Leistungshalbleitermodul mit Hilfsanschluss

Also Published As

Publication number Publication date
GB1349478A (en) 1974-04-03
SE372847B (de) 1975-01-13
DE2104726A1 (de) 1972-08-10
IE34925B1 (en) 1975-09-17
DE7103749U (de) 1971-10-28
IE34925L (en) 1971-08-02

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Legal Events

Date Code Title Description
ST Notification of lapse