FR2062952A7 - - Google Patents
Info
- Publication number
- FR2062952A7 FR2062952A7 FR7034224A FR7034224A FR2062952A7 FR 2062952 A7 FR2062952 A7 FR 2062952A7 FR 7034224 A FR7034224 A FR 7034224A FR 7034224 A FR7034224 A FR 7034224A FR 2062952 A7 FR2062952 A7 FR 2062952A7
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85992869A | 1969-09-22 | 1969-09-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2062952A7 true FR2062952A7 (de) | 1971-07-02 |
| FR2062952B3 FR2062952B3 (de) | 1973-06-08 |
Family
ID=25332077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7034224A Expired FR2062952B3 (de) | 1969-09-22 | 1970-09-22 |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE2041819A1 (de) |
| FR (1) | FR2062952B3 (de) |
| GB (1) | GB1279167A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918505A (en) * | 1988-07-19 | 1990-04-17 | Tektronix, Inc. | Method of treating an integrated circuit to provide a temperature sensor that is integral therewith |
| JP4650832B2 (ja) | 2002-12-20 | 2011-03-16 | アプライド マテリアルズ インコーポレイテッド | 半導体処理装置に使用するための拡散接合されたガス分配アッセンブリを製造する方法 |
| US7798388B2 (en) | 2007-05-31 | 2010-09-21 | Applied Materials, Inc. | Method of diffusion bonding a fluid flow apparatus |
-
1970
- 1970-08-22 DE DE19702041819 patent/DE2041819A1/de active Pending
- 1970-09-17 GB GB4441970A patent/GB1279167A/en not_active Expired
- 1970-09-22 FR FR7034224A patent/FR2062952B3/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2062952B3 (de) | 1973-06-08 |
| GB1279167A (en) | 1972-06-28 |
| DE2041819A1 (de) | 1971-04-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |