FR2055494A5 - - Google Patents

Info

Publication number
FR2055494A5
FR2055494A5 FR7027096A FR7027096A FR2055494A5 FR 2055494 A5 FR2055494 A5 FR 2055494A5 FR 7027096 A FR7027096 A FR 7027096A FR 7027096 A FR7027096 A FR 7027096A FR 2055494 A5 FR2055494 A5 FR 2055494A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7027096A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of FR2055494A5 publication Critical patent/FR2055494A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR7027096A 1969-07-22 1970-07-22 Expired FR2055494A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84353369A 1969-07-22 1969-07-22

Publications (1)

Publication Number Publication Date
FR2055494A5 true FR2055494A5 (fr) 1971-05-07

Family

ID=25290286

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7027096A Expired FR2055494A5 (fr) 1969-07-22 1970-07-22

Country Status (7)

Country Link
US (1) US3609471A (fr)
JP (1) JPS4732942B1 (fr)
DE (1) DE2035252A1 (fr)
FR (1) FR2055494A5 (fr)
GB (1) GB1320924A (fr)
IE (1) IE34370B1 (fr)
SE (1) SE358048B (fr)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
US3703306A (en) * 1970-11-09 1972-11-21 Xerox Corp Method of hermetically sealing silicon to a low expansion alloy
US3798509A (en) * 1970-11-30 1974-03-19 Semikron G F Gleichrichterbau Semiconductor circuit arrangement
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
US3771091A (en) * 1972-10-31 1973-11-06 Gen Electric Potted metal oxide varistor
US4187599A (en) * 1975-04-14 1980-02-12 Motorola, Inc. Semiconductor device having a tin metallization system and package containing same
FR2431900A1 (fr) * 1978-07-25 1980-02-22 Thomson Csf Systeme de soudure d'un laser a semiconducteur sur un socle metallique
US4218694A (en) * 1978-10-23 1980-08-19 Ford Motor Company Rectifying apparatus including six semiconductor diodes sandwiched between ceramic wafers
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package
GB2051474B (en) * 1979-06-19 1984-04-26 Aei Semiconductors Ltd Mounting arrangements for electrical components
US5032898A (en) * 1979-12-10 1991-07-16 Amp Incorporated Electro-optic device assembly having integral heat sink/retention means
US4352449A (en) * 1979-12-26 1982-10-05 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages
US4513905A (en) * 1983-07-29 1985-04-30 The Perkin-Elmer Corporation Integrated circuit metallization technique
JPH0810710B2 (ja) * 1984-02-24 1996-01-31 株式会社東芝 良熱伝導性基板の製造方法
GB2222721B (en) * 1988-08-23 1993-07-28 Nobuo Mikoshiba Cooling semiconductor devices
US5049976A (en) * 1989-01-10 1991-09-17 National Semiconductor Corporation Stress reduction package and process
JPH0766971B2 (ja) * 1989-06-07 1995-07-19 シャープ株式会社 炭化珪素半導体装置
US5830570A (en) * 1989-12-19 1998-11-03 Kyocera Corporation Aluminum nitride substrate and process for preparation thereof
US5311399A (en) * 1992-06-24 1994-05-10 The Carborundum Company High power ceramic microelectronic package
US5402032A (en) * 1992-10-29 1995-03-28 Litton Systems, Inc. Traveling wave tube with plate for bonding thermally-mismatched elements
US5679982A (en) * 1993-02-24 1997-10-21 Intel Corporation Barrier against metal diffusion
US5842626A (en) * 1995-03-31 1998-12-01 Intel Corporation Method for coupling surface mounted capacitors to semiconductor packages
GB2308446A (en) * 1995-12-20 1997-06-25 Bowthorpe Components Ltd Temperature sensor having a ceramic substrate with low electrical conductivity
JP2000106391A (ja) * 1998-07-28 2000-04-11 Ngk Insulators Ltd 半導体支持装置、その製造方法、接合体の製造方法および接合体
KR100831751B1 (ko) 2000-11-30 2008-05-23 노쓰 캐롤라이나 스테이트 유니버시티 Ｍ'ｎ 물의 제조 방법 및 장치
AU2002235146A1 (en) 2000-11-30 2002-06-11 North Carolina State University Non-thermionic sputter material transport device, methods of use, and materials produced thereby
US8053870B2 (en) * 2009-12-15 2011-11-08 International Business Machines Corporation Semiconductor structure incorporating multiple nitride layers to improve thermal dissipation away from a device and a method of forming the structure
US9646876B2 (en) 2015-02-27 2017-05-09 Applied Materials, Inc. Aluminum nitride barrier layer
US10279610B2 (en) 2016-12-20 2019-05-07 Xerox Corporation Cooling insert

Also Published As

Publication number Publication date
IE34370L (en) 1971-01-22
GB1320924A (en) 1973-06-20
SE358048B (fr) 1973-07-16
JPS4732942B1 (fr) 1972-08-22
DE2035252A1 (de) 1971-02-25
IE34370B1 (en) 1975-04-16
US3609471A (en) 1971-09-28

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Legal Events

Date Code Title Description
ST Notification of lapse