FR2046679A5 - Electroless nickel plating of silicon - transistors - Google Patents

Electroless nickel plating of silicon - transistors

Info

Publication number
FR2046679A5
FR2046679A5 FR7018982A FR7018982A FR2046679A5 FR 2046679 A5 FR2046679 A5 FR 2046679A5 FR 7018982 A FR7018982 A FR 7018982A FR 7018982 A FR7018982 A FR 7018982A FR 2046679 A5 FR2046679 A5 FR 2046679A5
Authority
FR
France
Prior art keywords
degrees
approx
rinsed
nh4f
pickled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7018982A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silec Semi Conducteurs SA
Original Assignee
Silec Semi Conducteurs SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silec Semi Conducteurs SA filed Critical Silec Semi Conducteurs SA
Priority to FR7018982A priority Critical patent/FR2046679A5/en
Application granted granted Critical
Publication of FR2046679A5 publication Critical patent/FR2046679A5/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01072—Hafnium [Hf]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)

Abstract

Modified pretreatment technique gives consistently good results with finer crystal structure and less variation between 'n' and 'p' zones. Soft solder or hard Au-Ge solder can be used to secure leads. Parts are treated on 'Teflon' (R.T.M.) trays or quartz plates for fumase operation, pickled in NH4F/HF mixture, pref. 6/1, rinsed and preheated to approx. 95 degrees C in deionized water, electroless Ni plated in conventional bath at about 95 degrees C for approx. 7 mins., rinsed and dried with acetone, heated in atmosphere to approx. 790 degrees C in under 15 min. and baked for 10 min., pickled in HCl and NH4F/HF, rinsed and preheated, replated for 5 min. at 95 degrees C and protected by Au electroplate. Process gives Ni coating thickness of 0.700 mu m first coat + 0.850 mu m second coat.
FR7018982A 1970-05-25 1970-05-25 Electroless nickel plating of silicon - transistors Expired FR2046679A5 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7018982A FR2046679A5 (en) 1970-05-25 1970-05-25 Electroless nickel plating of silicon - transistors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7018982A FR2046679A5 (en) 1970-05-25 1970-05-25 Electroless nickel plating of silicon - transistors

Publications (1)

Publication Number Publication Date
FR2046679A5 true FR2046679A5 (en) 1971-03-05

Family

ID=9056056

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7018982A Expired FR2046679A5 (en) 1970-05-25 1970-05-25 Electroless nickel plating of silicon - transistors

Country Status (1)

Country Link
FR (1) FR2046679A5 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6599563B2 (en) * 2001-01-02 2003-07-29 J.G. Systems Inc. Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6599563B2 (en) * 2001-01-02 2003-07-29 J.G. Systems Inc. Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals

Similar Documents

Publication Publication Date Title
US2734837A (en) Surface treatment of titanium or
US2355933A (en) Process of metal plating
ES382866A1 (en) Electroless plating solution and process
ES427394A1 (en) Process for stripping nickel from articles and composition utilized therein
FR2046679A5 (en) Electroless nickel plating of silicon - transistors
GB970474A (en) Improvements in and relating to processes for chemical treatment,and preparations for use therein
US3660293A (en) Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
GB918220A (en) Method of chemically plating a dielectric article
GB1075634A (en) Electrolytic treatment of titanium surfaces
US1902676A (en) Hardening alloy steels
GB1214420A (en) Surface-pretreatment of non-metallic articles for chemical nickel-plating
Yokobori The Time Effect in the Fracture of Glass from the Standpoint of Nucleation Theory
FR2158664A5 (en) Metal surface treatment baths - additive - for addition to hydrochloric and sulphuric acid based baths
NO131350B (en)
SU732219A1 (en) Method of ceramic base treatment prior to metallization
JPS6436788A (en) Pretreatment for plating titanium material with noble metal
GB1100712A (en) Treatment of polystyrene
US838977A (en) Solution for use in art of electrotyping.
JPS5629680A (en) Surface treatment in annealing line
ES442238A1 (en) Process and liquid for sensitizing articles for electroless metallization and resulting articles
GB1424660A (en) Producing a coating of metal on articles of non-metallic material
SU127293A1 (en) Nickel coating method for quartz plates
JPH01104781A (en) Surface treatment of titanium material
SU145101A1 (en) Method of electrolytic silvering of parts of a complex profile of aluminum and its alloys
SU148314A1 (en) The method of preparation of aluminum and its alloys for chemical nickel plating

Legal Events

Date Code Title Description
ST Notification of lapse