FR2032272A1 - - Google Patents

Info

Publication number
FR2032272A1
FR2032272A1 FR6937758A FR6937758A FR2032272A1 FR 2032272 A1 FR2032272 A1 FR 2032272A1 FR 6937758 A FR6937758 A FR 6937758A FR 6937758 A FR6937758 A FR 6937758A FR 2032272 A1 FR2032272 A1 FR 2032272A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6937758A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Energy Conversion Devices Inc
Original Assignee
Energy Conversion Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Energy Conversion Devices Inc filed Critical Energy Conversion Devices Inc
Publication of FR2032272A1 publication Critical patent/FR2032272A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/20Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
    • H10B63/24Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes of the Ovonic threshold switching type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
FR6937758A 1968-11-04 1969-11-03 Withdrawn FR2032272A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77301368A 1968-11-04 1968-11-04

Publications (1)

Publication Number Publication Date
FR2032272A1 true FR2032272A1 (https=) 1970-11-27

Family

ID=25096913

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6937758A Withdrawn FR2032272A1 (https=) 1968-11-04 1969-11-03

Country Status (8)

Country Link
US (1) US3629863A (https=)
JP (1) JPS5545988B1 (https=)
BE (1) BE741169A (https=)
CH (1) CH513570A (https=)
DE (1) DE1954966C3 (https=)
FR (1) FR2032272A1 (https=)
GB (1) GB1295453A (https=)
NL (1) NL6916593A (https=)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1308711A (en) * 1969-03-13 1973-03-07 Energy Conversion Devices Inc Combination switch units and integrated circuits
US3739356A (en) * 1971-06-21 1973-06-12 Ibm Heterojunction information storage unit
US3875566A (en) * 1973-10-29 1975-04-01 Energy Conversion Devices Inc Resetting filament-forming memory semiconductor devices with multiple reset pulses
DE2425467B1 (de) * 1974-05-27 1975-11-06 Heimann Gmbh Festwertspeichermatrix
US3979586A (en) * 1974-12-09 1976-09-07 Xerox Corporation Non-crystalline device memory array
US4181913A (en) * 1977-05-31 1980-01-01 Xerox Corporation Resistive electrode amorphous semiconductor negative resistance device
US4162538A (en) * 1977-07-27 1979-07-24 Xerox Corporation Thin film programmable read-only memory having transposable input and output lines
US4203123A (en) * 1977-12-12 1980-05-13 Burroughs Corporation Thin film memory device employing amorphous semiconductor materials
US4677742A (en) * 1983-01-18 1987-07-07 Energy Conversion Devices, Inc. Electronic matrix arrays and method for making the same
AU562641B2 (en) 1983-01-18 1987-06-18 Energy Conversion Devices Inc. Electronic matrix array
US4795657A (en) * 1984-04-13 1989-01-03 Energy Conversion Devices, Inc. Method of fabricating a programmable array
JPH0691223B2 (ja) * 1987-07-06 1994-11-14 三菱電機株式会社 Rom装置及びその形成方法
US4931763A (en) * 1988-02-16 1990-06-05 California Institute Of Technology Memory switches based on metal oxide thin films
US5989943A (en) * 1989-09-07 1999-11-23 Quicklogic Corporation Method for fabrication of programmable interconnect structure
US5502315A (en) * 1989-09-07 1996-03-26 Quicklogic Corporation Electrically programmable interconnect structure having a PECVD amorphous silicon element
US5294846A (en) * 1992-08-17 1994-03-15 Paivinen John O Method and apparatus for programming anti-fuse devices
US5424655A (en) * 1994-05-20 1995-06-13 Quicklogic Corporation Programmable application specific integrated circuit employing antifuses and methods therefor
US5900767A (en) * 1995-06-24 1999-05-04 U.S. Philips Corporation Electronic devices comprising an array
US5949088A (en) * 1996-10-25 1999-09-07 Micron Technology, Inc. Intermediate SRAM array product and method of conditioning memory elements thereof
US6888750B2 (en) 2000-04-28 2005-05-03 Matrix Semiconductor, Inc. Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication
US6580124B1 (en) 2000-08-14 2003-06-17 Matrix Semiconductor Inc. Multigate semiconductor device with vertical channel current and method of fabrication
AU2001286432A1 (en) 2000-08-14 2002-02-25 Matrix Semiconductor, Inc. Dense arrays and charge storage devices, and methods for making same
US6897514B2 (en) 2001-03-28 2005-05-24 Matrix Semiconductor, Inc. Two mask floating gate EEPROM and method of making
US6593624B2 (en) 2001-09-25 2003-07-15 Matrix Semiconductor, Inc. Thin film transistors with vertically offset drain regions
US6841813B2 (en) 2001-08-13 2005-01-11 Matrix Semiconductor, Inc. TFT mask ROM and method for making same
US6590797B1 (en) 2002-01-09 2003-07-08 Tower Semiconductor Ltd. Multi-bit programmable memory cell having multiple anti-fuse elements
US6853049B2 (en) 2002-03-13 2005-02-08 Matrix Semiconductor, Inc. Silicide-silicon oxide-semiconductor antifuse device and method of making
US6737675B2 (en) 2002-06-27 2004-05-18 Matrix Semiconductor, Inc. High density 3D rail stack arrays
US7589343B2 (en) * 2002-12-13 2009-09-15 Intel Corporation Memory and access device and method therefor
US6795338B2 (en) * 2002-12-13 2004-09-21 Intel Corporation Memory having access devices using phase change material such as chalcogenide
US7391664B2 (en) 2006-04-27 2008-06-24 Ovonyx, Inc. Page mode access for non-volatile memory arrays
US7684225B2 (en) * 2006-10-13 2010-03-23 Ovonyx, Inc. Sequential and video access for non-volatile memory arrays
US8377741B2 (en) * 2008-12-30 2013-02-19 Stmicroelectronics S.R.L. Self-heating phase change memory cell architecture
US9627395B2 (en) 2015-02-11 2017-04-18 Sandisk Technologies Llc Enhanced channel mobility three-dimensional memory structure and method of making thereof
US9478495B1 (en) 2015-10-26 2016-10-25 Sandisk Technologies Llc Three dimensional memory device containing aluminum source contact via structure and method of making thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3091754A (en) * 1958-05-08 1963-05-28 Nazare Edgar Henri Electric memory device
US3245051A (en) * 1960-11-16 1966-04-05 John H Robb Information storage matrices

Also Published As

Publication number Publication date
JPS5545988B1 (https=) 1980-11-20
BE741169A (https=) 1970-04-16
CH513570A (de) 1971-09-30
US3629863A (en) 1971-12-21
GB1295453A (https=) 1972-11-08
DE1954966A1 (de) 1970-05-06
DE1954966C3 (de) 1975-09-04
DE1954966B2 (de) 1975-01-09
NL6916593A (https=) 1970-05-08

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Legal Events

Date Code Title Description
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