FR2024550A1 - - Google Patents
Info
- Publication number
- FR2024550A1 FR2024550A1 FR6941120A FR6941120A FR2024550A1 FR 2024550 A1 FR2024550 A1 FR 2024550A1 FR 6941120 A FR6941120 A FR 6941120A FR 6941120 A FR6941120 A FR 6941120A FR 2024550 A1 FR2024550 A1 FR 2024550A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y10T225/325—With means to apply moment of force to weakened work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/19—Radially reciprocating jaws
- Y10T279/1926—Spiral cam or scroll actuated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/4979—Breaking through weakened portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53683—Spreading parts apart or separating them from face to face engagement
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3216668 | 1968-11-29 | ||
GB5679368A GB1243346A (en) | 1968-11-29 | 1968-11-29 | Improvements in and relating to methods of separating into pieces plates of material |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2024550A1 true FR2024550A1 (fr) | 1970-08-28 |
FR2024550B1 FR2024550B1 (fr) | 1974-06-14 |
Family
ID=26261245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR6941120A Expired FR2024550B1 (fr) | 1968-11-29 | 1969-11-28 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3657791A (fr) |
DE (1) | DE1956951A1 (fr) |
FR (1) | FR2024550B1 (fr) |
GB (1) | GB1243346A (fr) |
NL (1) | NL6917698A (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1578834A (en) * | 1976-04-30 | 1980-11-12 | Amerace Corp | Road marker |
US4109841A (en) * | 1976-05-26 | 1978-08-29 | Ppg Industries, Inc. | Apparatus for opening score lines in glass sheets |
US4644639A (en) * | 1984-12-21 | 1987-02-24 | At&T Technologies, Inc. | Method of supporting an article |
US4744550A (en) * | 1986-04-24 | 1988-05-17 | Asm America, Inc. | Vacuum wafer expander apparatus |
SG74007A1 (en) * | 1994-07-20 | 2000-07-18 | Loomis Ind Inc | Apparatus and method for dicing semiconductor wafers |
DE19606653C1 (de) * | 1996-02-23 | 1997-01-16 | Leica Ag | Einrichtung zum Brechen von Dreiecks-Glasmessern für die Ultra-Mikrotomie |
EP0975008A1 (fr) * | 1998-07-20 | 2000-01-26 | Alphasem AG | Méthode et dispositif pour traiter une pièce plate, en particulier une plaquette semiconductrice |
WO2006134532A2 (fr) * | 2005-06-16 | 2006-12-21 | Nxp B.V. | Outil destine a etirer la feuille d'un support de feuille, machine pour retirer des des d'une plaquette et methode pour retirer ces des |
JP6386866B2 (ja) * | 2014-10-10 | 2018-09-05 | リンテック株式会社 | 離間装置および離間方法 |
CN109773709B (zh) * | 2019-03-04 | 2020-06-02 | 北华大学 | 防盗锁凸轮机构的下压式装配工具 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2390139A (en) * | 1942-06-27 | 1945-12-04 | Rca Corp | Lead wire threading machine |
US2993701A (en) * | 1958-06-02 | 1961-07-25 | Skinner Chuck Company | Chuck opening and closing mechanism |
US3025743A (en) * | 1959-01-29 | 1962-03-20 | Vandio A Cecchi | Universal cartridge holder |
US3439402A (en) * | 1966-08-22 | 1969-04-22 | Westinghouse Electric Corp | Apparatus for combing component leads |
US3447224A (en) * | 1966-10-28 | 1969-06-03 | Motorola Inc | Aligning apparatus |
-
1968
- 1968-11-29 GB GB5679368A patent/GB1243346A/en not_active Expired
-
1969
- 1969-11-12 DE DE19691956951 patent/DE1956951A1/de active Pending
- 1969-11-25 NL NL6917698A patent/NL6917698A/xx unknown
- 1969-11-26 US US3657791D patent/US3657791A/en not_active Expired - Lifetime
- 1969-11-28 FR FR6941120A patent/FR2024550B1/fr not_active Expired
Non-Patent Citations (1)
Title |
---|
NEANT * |
Also Published As
Publication number | Publication date |
---|---|
US3657791A (en) | 1972-04-25 |
NL6917698A (fr) | 1970-06-02 |
FR2024550B1 (fr) | 1974-06-14 |
GB1243346A (en) | 1971-08-18 |
DE1956951A1 (de) | 1970-06-25 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |