FR2014743A1 - - Google Patents
Info
- Publication number
- FR2014743A1 FR2014743A1 FR6925619A FR6925619A FR2014743A1 FR 2014743 A1 FR2014743 A1 FR 2014743A1 FR 6925619 A FR6925619 A FR 6925619A FR 6925619 A FR6925619 A FR 6925619A FR 2014743 A1 FR2014743 A1 FR 2014743A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74807068A | 1968-07-26 | 1968-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2014743A1 true FR2014743A1 (fi) | 1970-04-17 |
Family
ID=25007867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR6925619A Withdrawn FR2014743A1 (fi) | 1968-07-26 | 1969-07-25 |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE1937755A1 (fi) |
| FR (1) | FR2014743A1 (fi) |
| GB (1) | GB1259883A (fi) |
| NL (1) | NL6911479A (fi) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2184715A1 (fi) * | 1972-05-13 | 1973-12-28 | Tokyo Shibaura Electric Co | |
| FR2206589A1 (fi) * | 1972-11-10 | 1974-06-07 | Philips Nv | |
| EP0001707A1 (en) * | 1977-10-17 | 1979-05-02 | John Fluke Mfg. Co., Inc. | A thermally isolated monolithic semiconductor die and a process for producing such a die |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599703B (zh) * | 2020-05-09 | 2021-09-03 | 中国电子科技集团公司第十三研究所 | SiC衬底上GaN器件或电路的梁式引线制备方法 |
-
1969
- 1969-07-25 GB GB37426/69A patent/GB1259883A/en not_active Expired
- 1969-07-25 FR FR6925619A patent/FR2014743A1/fr not_active Withdrawn
- 1969-07-25 DE DE19691937755 patent/DE1937755A1/de active Pending
- 1969-07-25 NL NL6911479A patent/NL6911479A/xx unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2184715A1 (fi) * | 1972-05-13 | 1973-12-28 | Tokyo Shibaura Electric Co | |
| FR2184716A1 (fi) * | 1972-05-13 | 1973-12-28 | Tokyo Shibaura Electric Co | |
| FR2206589A1 (fi) * | 1972-11-10 | 1974-06-07 | Philips Nv | |
| EP0001707A1 (en) * | 1977-10-17 | 1979-05-02 | John Fluke Mfg. Co., Inc. | A thermally isolated monolithic semiconductor die and a process for producing such a die |
Also Published As
| Publication number | Publication date |
|---|---|
| NL6911479A (fi) | 1970-01-28 |
| GB1259883A (en) | 1972-01-12 |
| DE1937755A1 (de) | 1970-02-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |