FR2014743A1 - - Google Patents

Info

Publication number
FR2014743A1
FR2014743A1 FR6925619A FR6925619A FR2014743A1 FR 2014743 A1 FR2014743 A1 FR 2014743A1 FR 6925619 A FR6925619 A FR 6925619A FR 6925619 A FR6925619 A FR 6925619A FR 2014743 A1 FR2014743 A1 FR 2014743A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6925619A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signetics Corp
Original Assignee
Signetics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Signetics Corp filed Critical Signetics Corp
Publication of FR2014743A1 publication Critical patent/FR2014743A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Element Separation (AREA)
FR6925619A 1968-07-26 1969-07-25 Withdrawn FR2014743A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74807068A 1968-07-26 1968-07-26

Publications (1)

Publication Number Publication Date
FR2014743A1 true FR2014743A1 (de) 1970-04-17

Family

ID=25007867

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6925619A Withdrawn FR2014743A1 (de) 1968-07-26 1969-07-25

Country Status (4)

Country Link
DE (1) DE1937755A1 (de)
FR (1) FR2014743A1 (de)
GB (1) GB1259883A (de)
NL (1) NL6911479A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2184716A1 (de) * 1972-05-13 1973-12-28 Tokyo Shibaura Electric Co
FR2206589A1 (de) * 1972-11-10 1974-06-07 Philips Nv
EP0001707A1 (de) * 1977-10-17 1979-05-02 John Fluke Mfg. Co., Inc. Thermisch isoliertes monolithisches Halbleiterplättchen und Verfahren zur Herstellung eines derartigen Plättchens

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111599703B (zh) * 2020-05-09 2021-09-03 中国电子科技集团公司第十三研究所 SiC衬底上GaN器件或电路的梁式引线制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2184716A1 (de) * 1972-05-13 1973-12-28 Tokyo Shibaura Electric Co
FR2184715A1 (de) * 1972-05-13 1973-12-28 Tokyo Shibaura Electric Co
FR2206589A1 (de) * 1972-11-10 1974-06-07 Philips Nv
EP0001707A1 (de) * 1977-10-17 1979-05-02 John Fluke Mfg. Co., Inc. Thermisch isoliertes monolithisches Halbleiterplättchen und Verfahren zur Herstellung eines derartigen Plättchens

Also Published As

Publication number Publication date
NL6911479A (de) 1970-01-28
GB1259883A (en) 1972-01-12
DE1937755A1 (de) 1970-02-12

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Legal Events

Date Code Title Description
ST Notification of lapse