FR2007395A1 - - Google Patents
Info
- Publication number
- FR2007395A1 FR2007395A1 FR6910062A FR6910062A FR2007395A1 FR 2007395 A1 FR2007395 A1 FR 2007395A1 FR 6910062 A FR6910062 A FR 6910062A FR 6910062 A FR6910062 A FR 6910062A FR 2007395 A1 FR2007395 A1 FR 2007395A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors having potential barriers
- H01L29/93—Variable capacitance diodes, e.g. varactors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681764125 DE1764125A1 (de) | 1968-04-05 | 1968-04-05 | Halbleitervorrichtung mit zwei in Gegentakt geschalteten Kapazitaetsdioden |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2007395A1 true FR2007395A1 (de) | 1970-01-09 |
FR2007395B1 FR2007395B1 (de) | 1973-10-19 |
Family
ID=5697865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR6910062A Expired FR2007395B1 (de) | 1968-04-05 | 1969-04-02 |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE1764125A1 (de) |
FR (1) | FR2007395B1 (de) |
GB (1) | GB1253282A (de) |
NL (1) | NL6905093A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5714782A (en) * | 1990-07-02 | 1998-02-03 | Kabushiki Kaisha Toshiba | Composite integrated circuit device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3193783A (en) * | 1960-05-17 | 1965-07-06 | Bendix Corp | Modulator for low magnitude voltage signals |
FR1513861A (fr) * | 1966-03-14 | 1968-02-16 | Siemens Ag | Condensateur à semi-conducteurs |
-
1968
- 1968-04-05 DE DE19681764125 patent/DE1764125A1/de active Pending
-
1969
- 1969-04-01 NL NL6905093A patent/NL6905093A/xx unknown
- 1969-04-02 FR FR6910062A patent/FR2007395B1/fr not_active Expired
- 1969-04-02 GB GB07215/69A patent/GB1253282A/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3193783A (en) * | 1960-05-17 | 1965-07-06 | Bendix Corp | Modulator for low magnitude voltage signals |
FR1513861A (fr) * | 1966-03-14 | 1968-02-16 | Siemens Ag | Condensateur à semi-conducteurs |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5714782A (en) * | 1990-07-02 | 1998-02-03 | Kabushiki Kaisha Toshiba | Composite integrated circuit device |
Also Published As
Publication number | Publication date |
---|---|
NL6905093A (de) | 1969-10-07 |
FR2007395B1 (de) | 1973-10-19 |
GB1253282A (en) | 1971-11-10 |
DE1764125A1 (de) | 1971-05-06 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |