FR1592313A - - Google Patents

Info

Publication number
FR1592313A
FR1592313A FR1592313DA FR1592313A FR 1592313 A FR1592313 A FR 1592313A FR 1592313D A FR1592313D A FR 1592313DA FR 1592313 A FR1592313 A FR 1592313A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1592313A publication Critical patent/FR1592313A/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W70/461—
    • H10W70/481—
    • H10W72/5363—
    • H10W72/5522—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y10T29/49829—Advancing work to successive stations [i.e., assembly line]
FR1592313D 1967-11-29 1968-11-19 Expired FR1592313A (Direct)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68658967A 1967-11-29 1967-11-29

Publications (1)

Publication Number Publication Date
FR1592313A true FR1592313A (Direct) 1970-05-11

Family

ID=24756931

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1592313D Expired FR1592313A (Direct) 1967-11-29 1968-11-19

Country Status (5)

Country Link
US (1) US3581387A (Direct)
DE (1) DE1801073B2 (Direct)
FR (1) FR1592313A (Direct)
GB (1) GB1181336A (Direct)
NL (1) NL6817115A (Direct)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1157498B (de) * 1959-09-29 1963-11-14 Stig Martin Lindblad Loesbare Befestigungseinrichtung fuer Kraftfahrzeug-Sicherheitsgurte u. dgl.
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
DE2608250C3 (de) * 1976-02-28 1985-06-05 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens
DE2714145C2 (de) * 1976-03-31 1985-01-10 Mitsubishi Denki K.K., Tokio/Tokyo Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
JPS58209147A (ja) * 1982-05-31 1983-12-06 Toshiba Corp 樹脂封止型半導体装置
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
US6159770A (en) * 1995-11-08 2000-12-12 Fujitsu Limited Method and apparatus for fabricating semiconductor device
KR20060079219A (ko) * 2003-09-16 2006-07-05 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 전자 디바이스, 이의 제조 방법 및 반제품
US7602054B2 (en) * 2005-10-05 2009-10-13 Semiconductor Components Industries, L.L.C. Method of forming a molded array package device having an exposed tab and structure

Also Published As

Publication number Publication date
DE1801073A1 (de) 1970-03-26
DE1801073B2 (de) 1973-04-19
NL6817115A (Direct) 1969-06-02
GB1181336A (en) 1970-02-11
US3581387A (en) 1971-06-01

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Legal Events

Date Code Title Description
ST Notification of lapse