|
GB1152809A
(en)
*
|
1968-05-07 |
1969-05-21 |
Standard Telephones Cables Ltd |
Electric Circuit Assembly
|
|
BE758871A
(fr)
*
|
1969-11-13 |
1971-05-12 |
Philips Nv |
Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
|
|
US3716846A
(en)
*
|
1970-01-24 |
1973-02-13 |
R Hafner |
Connector sheet with contacts on opposite sides
|
|
DE2057126C3
(de)
*
|
1970-05-14 |
1975-11-06 |
Siemens Ag, 1000 Berlin Und 8000 Muenchen |
Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen
|
|
US3670208A
(en)
*
|
1970-07-13 |
1972-06-13 |
Logic Dynamics Inc |
Microelectronic package, buss strip and printed circuit base assembly
|
|
US3726989A
(en)
*
|
1970-07-27 |
1973-04-10 |
Hughes Aircraft Co |
Circuit module providing high density interconnections
|
|
US3762040A
(en)
*
|
1971-10-06 |
1973-10-02 |
Western Electric Co |
Method of forming circuit crossovers
|
|
US3967296A
(en)
*
|
1972-10-12 |
1976-06-29 |
General Electric Company |
Semiconductor devices
|
|
US3912852A
(en)
*
|
1974-05-31 |
1975-10-14 |
Westinghouse Electric Corp |
Thin-film electrical circuit lead connection arrangement
|
|
JPS5116876A
(ja)
*
|
1974-07-31 |
1976-02-10 |
Sharp Kk |
Handotaisochi
|
|
US4044397A
(en)
*
|
1976-08-12 |
1977-08-23 |
The United States Of America As Represented By The Secretary Of The Air Force |
Integrated circuit wiring bridge apparatus
|
|
JPS5326867U
(Direct)
*
|
1976-08-16 |
1978-03-07 |
|
|
|
JPS58301Y2
(ja)
*
|
1977-10-06 |
1983-01-06 |
旭光学工業株式会社 |
多層フレキシブル基板
|
|
US4164071A
(en)
*
|
1977-12-27 |
1979-08-14 |
Ford Motor Company |
Method of forming a circuit board with integral terminals
|
|
JPS5396969U
(Direct)
*
|
1978-01-10 |
1978-08-07 |
|
|
|
US4254445A
(en)
*
|
1979-05-07 |
1981-03-03 |
International Business Machines Corporation |
Discretionary fly wire chip interconnection
|
|
US4518661A
(en)
*
|
1982-09-28 |
1985-05-21 |
Rippere Ralph E |
Consolidation of wires by chemical deposition and products resulting therefrom
|
|
IT1212711B
(it)
*
|
1983-03-09 |
1989-11-30 |
Ates Componenti Elettron |
Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
|
|
US4677528A
(en)
*
|
1984-05-31 |
1987-06-30 |
Motorola, Inc. |
Flexible printed circuit board having integrated circuit die or the like affixed thereto
|
|
US4767227A
(en)
*
|
1985-01-25 |
1988-08-30 |
Seiko Epson Corporation |
Print wire driving device for wire type dot printer
|
|
US5917707A
(en)
|
1993-11-16 |
1999-06-29 |
Formfactor, Inc. |
Flexible contact structure with an electrically conductive shell
|
|
US4717988A
(en)
*
|
1986-05-05 |
1988-01-05 |
Itt Defense Communications Division Of Itt Corporation |
Universal wafer scale assembly
|
|
IT1218104B
(it)
*
|
1986-06-27 |
1990-04-12 |
Sgs Microelettronica Spa |
Metodo di progettazione di microcalcolatori integrati e microcalcolatore integrato a struttura modulare ottenuto con il metodo suddetto
|
|
GB8706857D0
(en)
*
|
1987-03-23 |
1987-04-29 |
Bradley International Ltd Alle |
Chip carriers
|
|
US5148266A
(en)
*
|
1990-09-24 |
1992-09-15 |
Ist Associates, Inc. |
Semiconductor chip assemblies having interposer and flexible lead
|
|
US5679977A
(en)
*
|
1990-09-24 |
1997-10-21 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
|
US7198969B1
(en)
|
1990-09-24 |
2007-04-03 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
|
US5148265A
(en)
*
|
1990-09-24 |
1992-09-15 |
Ist Associates, Inc. |
Semiconductor chip assemblies with fan-in leads
|
|
US5258330A
(en)
*
|
1990-09-24 |
1993-11-02 |
Tessera, Inc. |
Semiconductor chip assemblies with fan-in leads
|
|
US5820014A
(en)
*
|
1993-11-16 |
1998-10-13 |
Form Factor, Inc. |
Solder preforms
|
|
US7073254B2
(en)
|
1993-11-16 |
2006-07-11 |
Formfactor, Inc. |
Method for mounting a plurality of spring contact elements
|
|
US6378199B1
(en)
|
1994-05-13 |
2002-04-30 |
Dai Nippon Printing Co., Ltd. |
Multi-layer printed-wiring board process for producing
|
|
JP3185540B2
(ja)
*
|
1994-06-10 |
2001-07-11 |
松下電器産業株式会社 |
半導体集積回路
|
|
US5994152A
(en)
*
|
1996-02-21 |
1999-11-30 |
Formfactor, Inc. |
Fabricating interconnects and tips using sacrificial substrates
|
|
US8033838B2
(en)
|
1996-02-21 |
2011-10-11 |
Formfactor, Inc. |
Microelectronic contact structure
|
|
US6552343B1
(en)
*
|
2000-05-18 |
2003-04-22 |
Telasic Communications, Inc. |
Unit cell with fan-out for large focal plane arrays with small detector pitch
|
|
DE102005053398B4
(de)
*
|
2005-11-09 |
2008-12-24 |
Semikron Elektronik Gmbh & Co. Kg |
Leistungshalbleitermodul
|
|
US8792161B2
(en)
*
|
2007-02-21 |
2014-07-29 |
Globalfoundries Inc. |
Optical polarizer with nanotube array
|
|
US20150237722A1
(en)
*
|
2014-02-20 |
2015-08-20 |
Ruey-Jen Hwu |
Anode Array
|