FR1571211A - - Google Patents
Info
- Publication number
- FR1571211A FR1571211A FR1571211DA FR1571211A FR 1571211 A FR1571211 A FR 1571211A FR 1571211D A FR1571211D A FR 1571211DA FR 1571211 A FR1571211 A FR 1571211A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64987767A | 1967-06-29 | 1967-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1571211A true FR1571211A (fr) | 1969-06-13 |
Family
ID=24606589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1571211D Expired FR1571211A (fr) | 1967-06-29 | 1968-06-28 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3508984A (fr) |
DE (1) | DE1765646A1 (fr) |
FR (1) | FR1571211A (fr) |
GB (1) | GB1232835A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2544954A1 (fr) * | 1983-04-20 | 1984-10-26 | Canon Kk | Procede de fabrication d'une tete d'enregistrement par jets de liquide |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4283844A (en) * | 1979-08-16 | 1981-08-18 | Hughes Aircraft Company | Method of making battery electrode structure |
JPS6050356B2 (ja) * | 1980-11-29 | 1985-11-08 | 大日本インキ化学工業株式会社 | 連続パタ−ンメツキ用レジスト塗膜の形成方法 |
JPH07105461B2 (ja) * | 1990-08-03 | 1995-11-13 | 三菱電機株式会社 | 半導体装置用絶縁基板の製造方法およびそのための金属パターン板 |
ES2140310B1 (es) * | 1997-07-30 | 2000-10-16 | Mecanismos Aux Es Ind S A | Perfeccionamientos en los diseños de entrepistas en los circuitos impresos de potencia. |
ES2170708B1 (es) * | 2000-11-20 | 2003-12-16 | Lear Automotive Eeds Spain | Procedimiento para incrementar la rigidez dielectrica y resistencia de aislamiento entre pistas de placas de circuito impreso. |
ITUD20020238A1 (it) * | 2002-11-11 | 2004-05-12 | New System Srl | Metodo per la stesura controllata a getto d'inchiostro di polimeri per isolamento e/o protezione di circuiti stampati |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2695351A (en) * | 1950-01-12 | 1954-11-23 | Beck S Inc | Electric circuit components and methods of preparing the same |
US2955027A (en) * | 1957-08-07 | 1960-10-04 | Isaac L Newell | Method for the deburring of zinc-base die castings |
-
1967
- 1967-06-29 US US649877A patent/US3508984A/en not_active Expired - Lifetime
-
1968
- 1968-06-24 GB GB1232835D patent/GB1232835A/en not_active Expired
- 1968-06-25 DE DE19681765646 patent/DE1765646A1/de active Pending
- 1968-06-28 FR FR1571211D patent/FR1571211A/fr not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2544954A1 (fr) * | 1983-04-20 | 1984-10-26 | Canon Kk | Procede de fabrication d'une tete d'enregistrement par jets de liquide |
Also Published As
Publication number | Publication date |
---|---|
DE1765646A1 (de) | 1971-08-26 |
GB1232835A (fr) | 1971-05-19 |
US3508984A (en) | 1970-04-28 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |