FR1505070A - Procédé de production de configurations sous forme d'une pellicule mince sur un substrat - Google Patents
Procédé de production de configurations sous forme d'une pellicule mince sur un substratInfo
- Publication number
- FR1505070A FR1505070A FR87468A FR87468A FR1505070A FR 1505070 A FR1505070 A FR 1505070A FR 87468 A FR87468 A FR 87468A FR 87468 A FR87468 A FR 87468A FR 1505070 A FR1505070 A FR 1505070A
- Authority
- FR
- France
- Prior art keywords
- substrate
- thin film
- producing patterns
- patterns
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53996866A | 1966-04-04 | 1966-04-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1505070A true FR1505070A (fr) | 1967-12-08 |
Family
ID=24153407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR87468A Expired FR1505070A (fr) | 1966-04-04 | 1966-12-14 | Procédé de production de configurations sous forme d'une pellicule mince sur un substrat |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1505070A (fr) |
-
1966
- 1966-12-14 FR FR87468A patent/FR1505070A/fr not_active Expired
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