FR1496404A - Procédés de revêtement de métaux sur des matières plastiques et nouveaux produits ainsi obtenus - Google Patents

Procédés de revêtement de métaux sur des matières plastiques et nouveaux produits ainsi obtenus

Info

Publication number
FR1496404A
FR1496404A FR79520A FR79520A FR1496404A FR 1496404 A FR1496404 A FR 1496404A FR 79520 A FR79520 A FR 79520A FR 79520 A FR79520 A FR 79520A FR 1496404 A FR1496404 A FR 1496404A
Authority
FR
France
Prior art keywords
plastics
processes
new products
coating metals
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR79520A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borg Warner Corp
Original Assignee
Borg Warner Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borg Warner Corp filed Critical Borg Warner Corp
Application granted granted Critical
Publication of FR1496404A publication Critical patent/FR1496404A/fr
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/26Roughening, e.g. by etching using organic liquids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/9335Product by special process
    • Y10S428/934Electrical process
    • Y10S428/935Electroplating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/9335Product by special process
    • Y10S428/936Chemical deposition, e.g. electroless plating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556Organic component
    • Y10T428/12569Synthetic resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639Adjacent, identical composition, components
    • Y10T428/12646Group VIII or IB metal-base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12903Cu-base component
    • Y10T428/1291Next to Co-, Cu-, or Ni-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers
    • Y10T428/31931Polyene monomer-containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers
    • Y10T428/31935Ester, halide or nitrile of addition polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
FR79520A 1965-10-11 1966-10-11 Procédés de revêtement de métaux sur des matières plastiques et nouveaux produits ainsi obtenus Expired FR1496404A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49486165A 1965-10-11 1965-10-11
US49485965A 1965-10-11 1965-10-11

Publications (1)

Publication Number Publication Date
FR1496404A true FR1496404A (fr) 1967-09-29

Family

ID=27051571

Family Applications (1)

Application Number Title Priority Date Filing Date
FR79520A Expired FR1496404A (fr) 1965-10-11 1966-10-11 Procédés de revêtement de métaux sur des matières plastiques et nouveaux produits ainsi obtenus

Country Status (4)

Country Link
US (2) US3479160A (enExample)
FR (1) FR1496404A (enExample)
GB (1) GB1162393A (enExample)
NL (1) NL6614306A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2060422A1 (enExample) * 1969-09-05 1971-06-18 Mitsui Mining & Smelting Co

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE706158A (enExample) * 1966-11-10 1968-05-07
US3770571A (en) * 1969-04-02 1973-11-06 Richardson Co Fabrication of printed circuit boards
US3622370A (en) * 1969-04-07 1971-11-23 Macdermid Inc Method of and solution for accelerating activation of plastic substrates in electroless metal plating system
US3698940A (en) 1970-01-26 1972-10-17 Macdermid Inc Method of making additive printed circuit boards and product thereof
DE2113244C3 (de) * 1970-03-16 1984-05-17 Photocircuits Division of Kollmorgen Corp., Glen Cove, N.Y. Verfahren zum direkten Metallisieren freiliegender Flächen auf einem eine Epoxydharzoberfläche aufweisenden, isolierenden Material
CA956850A (en) * 1970-03-16 1974-10-29 Frederick W. Schneble (Jr.) Direct bonding of electroless metals to substrates
US3650708A (en) * 1970-03-30 1972-03-21 Hooker Chemical Corp Metal plating of substrates
US3681511A (en) * 1970-09-22 1972-08-01 Hooker Chemical Corp Uses of and improvements in the coating of substrates
US3769061A (en) * 1971-06-14 1973-10-30 Shipley Co Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
CS154977B1 (enExample) * 1971-10-08 1974-04-30
US3892635A (en) * 1971-10-28 1975-07-01 Enthone Pre-conditioner and process
BE793267A (fr) * 1971-12-27 1973-06-22 Hooker Chemical Corp Surface porteuse perfectionnee
US3772161A (en) * 1972-01-03 1973-11-13 Borg Warner Method of selectively electroplating thermoplastic substrates using a strippable coating mask
GB1381243A (en) * 1972-02-18 1975-01-22 Kollmorgen Corp Method for metallizing substrates
CH565248A5 (enExample) * 1972-07-18 1975-08-15 Mueller Hans Maennedorf
JPS5133834B2 (enExample) * 1973-04-25 1976-09-22
US3905877A (en) * 1974-02-19 1975-09-16 Du Pont Process for electroplating polyoxymethylene
US3915809A (en) * 1974-05-24 1975-10-28 Gen Motors Corp Plating adherent metal coatings onto polymethyl methacrylate materials
US3868229A (en) * 1974-06-10 1975-02-25 Int Nickel Co Decorative electroplates for plastics
JPS5126391U (enExample) * 1974-08-14 1976-02-26
US4272584A (en) * 1979-10-16 1981-06-09 Borg-Warner Corporation Platable high heat ABS resins and plated articles made therefrom
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
US5178956A (en) * 1989-10-03 1993-01-12 Shipley Company Inc. Pretreatment process for electroless plating of polyimides
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
US5075039A (en) * 1990-05-31 1991-12-24 Shipley Company Inc. Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles
JP2828584B2 (ja) * 1993-12-27 1998-11-25 株式会社小糸製作所 自動車用ヘッドランプ
CA2152447C (en) 1994-06-29 2006-06-06 Charles L. Myers Filled polyphthalamide blends having improved plating characteristics and plated articles therefrom
US20060191145A1 (en) * 2001-08-24 2006-08-31 Waddington North America, Inc. Metallized cutlery and tableware and method therefor
DE60226332T2 (de) 2001-08-24 2009-07-09 Waddington North America, Inc., Chelmsford Metallisiertes besteck
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
US20060292385A1 (en) * 2004-07-27 2006-12-28 Andreas Renekn Method of plating mineral filled polyamide compositions and articles formed thereby
US8632864B2 (en) * 2009-08-24 2014-01-21 Lacks Industries, Inc. Decorative surface finish and method of forming same
US10260000B2 (en) 2012-01-23 2019-04-16 Macdermid Acumen, Inc. Etching of plastic using acidic solutions containing trivalent manganese
US20160111765A1 (en) * 2014-10-17 2016-04-21 Hughes Network Systems, Llc Metallized plastic high radio frequency integrated waveguide
JP2021524525A (ja) 2018-07-13 2021-09-13 ソルベイ スペシャルティ ポリマーズ ユーエスエー, エルエルシー ポリマー成分と金属コーティングとを含む物品/部品
WO2020011813A1 (en) 2018-07-13 2020-01-16 Solvay Specialty Polymers Usa, Llc Article/part comprising a polymeric component and a metallic coating
DE102023114956A1 (de) * 2023-06-07 2024-12-12 Dr. Hesse GmbH & Cie. KG Verfahren zum Beizen nichtleitender Kunststoffe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2060422A1 (enExample) * 1969-09-05 1971-06-18 Mitsui Mining & Smelting Co

Also Published As

Publication number Publication date
US3479160A (en) 1969-11-18
DE1620768B2 (de) 1975-06-19
US3445350A (en) 1969-05-20
GB1162393A (en) 1969-08-27
NL6614306A (enExample) 1967-04-12
DE1620768A1 (de) 1970-05-14

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