FR1483574A - - Google Patents

Info

Publication number
FR1483574A
FR1483574A FR1483574DA FR1483574A FR 1483574 A FR1483574 A FR 1483574A FR 1483574D A FR1483574D A FR 1483574DA FR 1483574 A FR1483574 A FR 1483574A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Application granted granted Critical
Publication of FR1483574A publication Critical patent/FR1483574A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
FR1483574D 1965-06-24 Expired FR1483574A (show.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US466625A US3392442A (en) 1965-06-24 1965-06-24 Solder method for providing standoff of device from substrate

Publications (1)

Publication Number Publication Date
FR1483574A true FR1483574A (show.php) 1967-09-06

Family

ID=23852494

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1483574D Expired FR1483574A (show.php) 1965-06-24

Country Status (2)

Country Link
US (1) US3392442A (show.php)
FR (1) FR1483574A (show.php)

Families Citing this family (63)

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US3731375A (en) * 1966-03-31 1973-05-08 Ibm Monolithic integrated structure including fabrication and packaging therefor
US3480841A (en) * 1967-01-13 1969-11-25 Ibm Solderable backside ohmic contact metal system for semiconductor devices and fabrication process therefor
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3495324A (en) * 1967-11-13 1970-02-17 Sperry Rand Corp Ohmic contact for planar devices
US3607379A (en) * 1968-01-22 1971-09-21 Us Navy Microelectronic interconnection substrate
US3680198A (en) * 1970-10-07 1972-08-01 Fairchild Camera Instr Co Assembly method for attaching semiconductor devices
US3735479A (en) * 1970-11-27 1973-05-29 Bendix Corp Method of fusion-bonding parts by partial liquid phase formation
US3823469A (en) * 1971-04-28 1974-07-16 Rca Corp High heat dissipation solder-reflow flip chip transistor
US3808681A (en) * 1971-08-31 1974-05-07 A Stricker Automatic pin insertion and bonding to a metallized pad on a substrate surface
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
US3926360A (en) * 1974-05-28 1975-12-16 Burroughs Corp Method of attaching a flexible printed circuit board to a rigid printed circuit board
US3986255A (en) * 1974-11-29 1976-10-19 Itek Corporation Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
US4352449A (en) * 1979-12-26 1982-10-05 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages
US4505029A (en) * 1981-03-23 1985-03-19 General Electric Company Semiconductor device with built-up low resistance contact
US4486945A (en) * 1981-04-21 1984-12-11 Seiichiro Aigoo Method of manufacturing semiconductor device with plated bump
JPS61276237A (ja) * 1985-05-31 1986-12-06 Hitachi Ltd 半導体パツケ−ジの気密封止方法およびその装置
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4908689A (en) * 1986-05-06 1990-03-13 International Business Machines Corporation Organic solder barrier
US4948031A (en) * 1986-11-10 1990-08-14 Hazeltine Corporation Process for bonding aluminum with cadmium and product thereof
US5151332A (en) * 1986-11-10 1992-09-29 Hazeltine Corporation Aluminum sheets bonded with cadmium
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4739917A (en) * 1987-01-12 1988-04-26 Ford Motor Company Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors
US5170931A (en) * 1987-03-11 1992-12-15 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US4788767A (en) * 1987-03-11 1988-12-06 International Business Machines Corporation Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US5159535A (en) * 1987-03-11 1992-10-27 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US4840302A (en) * 1988-04-15 1989-06-20 International Business Machines Corporation Chromium-titanium alloy
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
DE69021438T2 (de) * 1989-05-16 1996-01-25 Marconi Gec Ltd Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung.
US4967950A (en) * 1989-10-31 1990-11-06 International Business Machines Corporation Soldering method
US5534442A (en) * 1991-05-10 1996-07-09 Northern Telecom Limited Process of providing uniform photoresist thickness on an opto-electronic device
JP3141364B2 (ja) * 1992-05-06 2001-03-05 住友電気工業株式会社 半導体チップ
US5406701A (en) * 1992-10-02 1995-04-18 Irvine Sensors Corporation Fabrication of dense parallel solder bump connections
US5376584A (en) * 1992-12-31 1994-12-27 International Business Machines Corporation Process of making pad structure for solder ball limiting metallurgy having reduced edge stress
US5369880A (en) * 1993-05-06 1994-12-06 Motorola, Inc. Method for forming solder deposit on a substrate
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6008071A (en) * 1995-09-20 1999-12-28 Fujitsu Limited Method of forming solder bumps onto an integrated circuit device
US5803343A (en) * 1995-10-30 1998-09-08 Delco Electronics Corp. Solder process for enhancing reliability of multilayer hybrid circuits
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5740605A (en) * 1996-07-25 1998-04-21 Texas Instruments Incorporated Bonded z-axis interface
US5803344A (en) * 1996-09-09 1998-09-08 Delco Electronics Corp. Dual-solder process for enhancing reliability of thick-film hybrid circuits
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
US6070321A (en) 1997-07-09 2000-06-06 International Business Machines Corporation Solder disc connection
KR19990029741A (ko) * 1997-09-29 1999-04-26 갈라스 윌리엄 이 금 도금되는 땜납 재료와 땜납을 이용하여 플럭스 없이 납땜하는 방법
US5984164A (en) 1997-10-31 1999-11-16 Micron Technology, Inc. Method of using an electrically conductive elevation shaping tool
US6037192A (en) * 1998-01-22 2000-03-14 Nortel Networks Corporation Process of assembling an integrated circuit and a terminal substrate using solder reflow and adhesive cure
US6424630B1 (en) 1998-10-30 2002-07-23 Advanced Micro Devices, Inc. Apparatus and method for calibrating a home networking station receiving network signals on a telephone line medium
EP1243026A1 (en) * 1999-12-21 2002-09-25 Advanced Micro Devices, Inc. Organic packages with solders for reliable flip chip connections
US6400574B1 (en) * 2000-05-11 2002-06-04 Micron Technology, Inc. Molded ball grid array
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US6762503B2 (en) * 2002-08-29 2004-07-13 Micron Technology, Inc. Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same
US9084377B2 (en) * 2007-03-30 2015-07-14 Stats Chippac Ltd. Integrated circuit package system with mounting features for clearance
US7994043B1 (en) 2008-04-24 2011-08-09 Amkor Technology, Inc. Lead free alloy bump structure and fabrication method
CN102124563B (zh) * 2008-06-30 2013-07-17 三洋电机株式会社 元件搭载用基板、半导体模块、半导体装置、元件搭载用基板的制造方法、半导体装置的制造方法及便携式设备
KR101283580B1 (ko) * 2011-12-14 2013-07-05 엠케이전자 주식회사 주석계 솔더 볼 및 이를 포함하는 반도체 패키지
WO2016007863A2 (en) * 2014-07-10 2016-01-14 Kandou Labs, S.A. Vector signaling codes with increased signal to noise characteristics
US11128129B2 (en) 2019-04-08 2021-09-21 Kandou Labs, S.A. Distributed electrostatic discharge scheme to improve analog front-end bandwidth of receiver in high-speed signaling system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3046651A (en) * 1958-03-14 1962-07-31 Honeywell Regulator Co Soldering technique
US3292240A (en) * 1963-08-08 1966-12-20 Ibm Method of fabricating microminiature functional components
US3303393A (en) * 1963-12-27 1967-02-07 Ibm Terminals for microminiaturized devices and methods of connecting same to circuit panels

Also Published As

Publication number Publication date
US3392442A (en) 1968-07-16

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