FR1468584A - Stabilized bath for chemical copper plating - Google Patents

Stabilized bath for chemical copper plating

Info

Publication number
FR1468584A
FR1468584A FR50226A FR50226A FR1468584A FR 1468584 A FR1468584 A FR 1468584A FR 50226 A FR50226 A FR 50226A FR 50226 A FR50226 A FR 50226A FR 1468584 A FR1468584 A FR 1468584A
Authority
FR
France
Prior art keywords
copper plating
chemical copper
stabilized
stabilized bath
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR50226A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DESCH36568A external-priority patent/DE1266099B/en
Application filed by Schering AG filed Critical Schering AG
Priority to FR50226A priority Critical patent/FR1468584A/en
Application granted granted Critical
Publication of FR1468584A publication Critical patent/FR1468584A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
FR50226A 1965-02-20 1966-02-18 Stabilized bath for chemical copper plating Expired FR1468584A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR50226A FR1468584A (en) 1965-02-20 1966-02-18 Stabilized bath for chemical copper plating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DESCH36568A DE1266099B (en) 1965-02-20 1965-02-20 Bath for the reductive copper deposition
FR50226A FR1468584A (en) 1965-02-20 1966-02-18 Stabilized bath for chemical copper plating

Publications (1)

Publication Number Publication Date
FR1468584A true FR1468584A (en) 1967-02-03

Family

ID=25993247

Family Applications (1)

Application Number Title Priority Date Filing Date
FR50226A Expired FR1468584A (en) 1965-02-20 1966-02-18 Stabilized bath for chemical copper plating

Country Status (1)

Country Link
FR (1) FR1468584A (en)

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