FR1468584A - Stabilized bath for chemical copper plating - Google Patents
Stabilized bath for chemical copper platingInfo
- Publication number
- FR1468584A FR1468584A FR50226A FR50226A FR1468584A FR 1468584 A FR1468584 A FR 1468584A FR 50226 A FR50226 A FR 50226A FR 50226 A FR50226 A FR 50226A FR 1468584 A FR1468584 A FR 1468584A
- Authority
- FR
- France
- Prior art keywords
- copper plating
- chemical copper
- stabilized
- stabilized bath
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR50226A FR1468584A (en) | 1965-02-20 | 1966-02-18 | Stabilized bath for chemical copper plating |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DESCH36568A DE1266099B (en) | 1965-02-20 | 1965-02-20 | Bath for the reductive copper deposition |
FR50226A FR1468584A (en) | 1965-02-20 | 1966-02-18 | Stabilized bath for chemical copper plating |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1468584A true FR1468584A (en) | 1967-02-03 |
Family
ID=25993247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR50226A Expired FR1468584A (en) | 1965-02-20 | 1966-02-18 | Stabilized bath for chemical copper plating |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1468584A (en) |
-
1966
- 1966-02-18 FR FR50226A patent/FR1468584A/en not_active Expired
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