CH464638A - Additive for acidic copper plating bath - Google Patents
Additive for acidic copper plating bathInfo
- Publication number
- CH464638A CH464638A CH323465A CH323465A CH464638A CH 464638 A CH464638 A CH 464638A CH 323465 A CH323465 A CH 323465A CH 323465 A CH323465 A CH 323465A CH 464638 A CH464638 A CH 464638A
- Authority
- CH
- Switzerland
- Prior art keywords
- additive
- plating bath
- copper plating
- acidic copper
- acidic
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 230000002378 acidificating effect Effects 0.000 title 1
- 239000000654 additive Substances 0.000 title 1
- 230000000996 additive effect Effects 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Motor Or Generator Current Collectors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS139164 | 1964-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH464638A true CH464638A (en) | 1968-10-31 |
Family
ID=5348157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH323465A CH464638A (en) | 1964-03-11 | 1965-03-09 | Additive for acidic copper plating bath |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3360447A (en) |
| AT (1) | AT271128B (en) |
| BE (1) | BE660618A (en) |
| CH (1) | CH464638A (en) |
| DE (1) | DE1236298B (en) |
| FR (1) | FR1426629A (en) |
| GB (1) | GB1064769A (en) |
| NL (1) | NL6503040A (en) |
| SE (1) | SE305348B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5266212A (en) * | 1992-10-13 | 1993-11-30 | Enthone-Omi, Inc. | Purification of cyanide-free copper plating baths |
| CN102418117B (en) * | 2011-11-29 | 2014-04-16 | 宁波蓝鼎电子科技有限公司 | Method for electrolytic refining in fire refining of cathode copper |
| CN112144083B (en) * | 2020-09-22 | 2021-12-10 | 广州三孚新材料科技股份有限公司 | Cyanide-free copper plating electroplating solution for solar cell and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2733198A (en) * | 1956-01-31 | Acid copper plating bath | ||
| US2271209A (en) * | 1934-06-05 | 1942-01-27 | United States Steel Corp | Electrodeposited tin and process of electrodeposition |
| US2680711A (en) * | 1950-03-10 | 1954-06-08 | Norwitz George | Deposition of copper by immersion |
| US2888390A (en) * | 1956-11-08 | 1959-05-26 | Anaconda Co | Electrolytic refining of copper |
-
1965
- 1965-02-22 GB GB7514/65A patent/GB1064769A/en not_active Expired
- 1965-03-01 DE DES95720A patent/DE1236298B/en active Pending
- 1965-03-01 US US436332A patent/US3360447A/en not_active Expired - Lifetime
- 1965-03-04 BE BE660618D patent/BE660618A/xx unknown
- 1965-03-09 CH CH323465A patent/CH464638A/en unknown
- 1965-03-10 NL NL6503040A patent/NL6503040A/xx unknown
- 1965-03-10 AT AT214365A patent/AT271128B/en active
- 1965-03-11 SE SE3154/65A patent/SE305348B/xx unknown
- 1965-03-11 FR FR8828A patent/FR1426629A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| BE660618A (en) | 1965-07-01 |
| FR1426629A (en) | 1966-01-28 |
| DE1236298B (en) | 1967-03-09 |
| US3360447A (en) | 1967-12-26 |
| SE305348B (en) | 1968-10-21 |
| GB1064769A (en) | 1967-04-12 |
| AT271128B (en) | 1969-05-27 |
| NL6503040A (en) | 1965-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CH439041A (en) | Component for Schier | |
| CH439589A (en) | Bath additive | |
| CH432045A (en) | Circuit arrangement for an ergometer | |
| IL23456A (en) | Metal plating processes | |
| FR1436451A (en) | New bath for electroplating palladium | |
| CH441925A (en) | Electroless plating | |
| AT265036B (en) | Sliding head for automatic assembly lines | |
| CH464638A (en) | Additive for acidic copper plating bath | |
| CH464643A (en) | Stabilized bath for chemical copper plating | |
| AT285268B (en) | Additives for acidic electroplating baths | |
| BR6567577D0 (en) | PERFECT COMPOSITES OF ACID GALVANIC COPPER BATHS | |
| FR1498966A (en) | Non-electrolytic deposition of copper | |
| CH438874A (en) | Electrolytic nickel bath | |
| CH428370A (en) | Electroplating apparatus | |
| CH426361A (en) | Laying nest for poultry | |
| FR1424042A (en) | Solution for electroplating nickel | |
| FR1448673A (en) | Additive for acid baths for electrolytic copper plating | |
| CH384322A (en) | Installation for electroplating | |
| FR1403180A (en) | Improvements to non-electrolytic copper baths | |
| FR1295775A (en) | Solution for electroplating copper | |
| FR1446908A (en) | Electroplating solutions for zinc deposition | |
| AT300984B (en) | Binder for electrocoating baths | |
| FR1483747A (en) | Feed additive for chicken feed | |
| FR1475377A (en) | Additives for electroplating baths | |
| FR1468442A (en) | Copper pickling |