FR1399295A - Composite wafer formed from a semiconductor and an insulator and method for its production - Google Patents

Composite wafer formed from a semiconductor and an insulator and method for its production

Info

Publication number
FR1399295A
FR1399295A FR979128A FR979128A FR1399295A FR 1399295 A FR1399295 A FR 1399295A FR 979128 A FR979128 A FR 979128A FR 979128 A FR979128 A FR 979128A FR 1399295 A FR1399295 A FR 1399295A
Authority
FR
France
Prior art keywords
insulator
semiconductor
production
wafer formed
composite wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR979128A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US291338A external-priority patent/US3300832A/en
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Priority to FR979128A priority Critical patent/FR1399295A/en
Application granted granted Critical
Publication of FR1399295A publication Critical patent/FR1399295A/en
Priority claimed from US571276A external-priority patent/US3370204A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/764—Air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
FR979128A 1963-06-28 1964-06-22 Composite wafer formed from a semiconductor and an insulator and method for its production Expired FR1399295A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR979128A FR1399295A (en) 1963-06-28 1964-06-22 Composite wafer formed from a semiconductor and an insulator and method for its production

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US291338A US3300832A (en) 1963-06-28 1963-06-28 Method of making composite insulatorsemiconductor wafer
FR979128A FR1399295A (en) 1963-06-28 1964-06-22 Composite wafer formed from a semiconductor and an insulator and method for its production
US571276A US3370204A (en) 1963-06-28 1966-08-09 Composite insulator-semiconductor wafer

Publications (1)

Publication Number Publication Date
FR1399295A true FR1399295A (en) 1965-05-14

Family

ID=27248084

Family Applications (1)

Application Number Title Priority Date Filing Date
FR979128A Expired FR1399295A (en) 1963-06-28 1964-06-22 Composite wafer formed from a semiconductor and an insulator and method for its production

Country Status (1)

Country Link
FR (1) FR1399295A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614357B1 (en) * 1966-02-17 1971-10-21 Rca Corp Method for manufacturing an integrated semiconductor circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614357B1 (en) * 1966-02-17 1971-10-21 Rca Corp Method for manufacturing an integrated semiconductor circuit

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