FR1296802A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- FR1296802A FR1296802A FR865779A FR865779A FR1296802A FR 1296802 A FR1296802 A FR 1296802A FR 865779 A FR865779 A FR 865779A FR 865779 A FR865779 A FR 865779A FR 1296802 A FR1296802 A FR 1296802A
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4922—Bases or plates or solder therefor having a heterogeneous or anisotropic structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Arc-Extinguishing Devices That Are Switches (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES69069A DE1141029B (en) | 1960-06-23 | 1960-06-23 | Semiconductor device and method for its manufacture |
DES71897A DE1153461B (en) | 1960-06-23 | 1960-12-30 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1296802A true FR1296802A (en) | 1962-06-22 |
Family
ID=25996125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR865779A Expired FR1296802A (en) | 1960-06-23 | 1961-06-22 | Semiconductor device |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE605338A (en) |
CH (1) | CH390401A (en) |
DE (1) | DE1153461B (en) |
FR (1) | FR1296802A (en) |
GB (1) | GB914839A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2479565A1 (en) * | 1980-03-27 | 1981-10-02 | Asea Ab | COMPOSITE MATERIAL WITH LOW COEFFICIENT OF THERMAL EXPANSION AND GOOD THERMAL CONDUCTIVITY |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4385310A (en) * | 1978-03-22 | 1983-05-24 | General Electric Company | Structured copper strain buffer |
DE3070263D1 (en) * | 1979-03-08 | 1985-04-18 | Gen Electric | Thermo-compression bonding a semiconductor to strain buffer |
DE2936816A1 (en) * | 1979-08-17 | 1981-03-26 | BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau | High current silicon semiconductor cooling system - has wires soldered to metallised islands on surface of silicon disc, extending outwards |
US5262718A (en) * | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
US5631447A (en) * | 1988-02-05 | 1997-05-20 | Raychem Limited | Uses of uniaxially electrically conductive articles |
GB8818957D0 (en) * | 1988-08-10 | 1988-09-14 | Marconi Electronic Devices | Semiconductor devices |
DE102012200278A1 (en) * | 2012-01-11 | 2013-07-11 | Robert Bosch Gmbh | Unpackaged power semiconductor e.g. FET for use in circuit carrier, has electrical conductive individual-conductors extending transverse to surface area, where part of each conductor is connected with surface area in end region |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL208617A (en) * | 1955-05-10 | 1900-01-01 | ||
US2806187A (en) * | 1955-11-08 | 1957-09-10 | Westinghouse Electric Corp | Semiconductor rectifier device |
-
1960
- 1960-12-30 DE DES71897A patent/DE1153461B/en active Pending
-
1961
- 1961-06-16 CH CH704461A patent/CH390401A/en unknown
- 1961-06-22 FR FR865779A patent/FR1296802A/en not_active Expired
- 1961-06-23 GB GB2287261A patent/GB914839A/en not_active Expired
- 1961-06-23 BE BE605338A patent/BE605338A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2479565A1 (en) * | 1980-03-27 | 1981-10-02 | Asea Ab | COMPOSITE MATERIAL WITH LOW COEFFICIENT OF THERMAL EXPANSION AND GOOD THERMAL CONDUCTIVITY |
Also Published As
Publication number | Publication date |
---|---|
DE1153461B (en) | 1963-08-29 |
BE605338A (en) | 1961-10-16 |
GB914839A (en) | 1963-01-09 |
CH390401A (en) | 1965-04-15 |
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