CH390401A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
CH390401A
CH390401A CH704461A CH704461A CH390401A CH 390401 A CH390401 A CH 390401A CH 704461 A CH704461 A CH 704461A CH 704461 A CH704461 A CH 704461A CH 390401 A CH390401 A CH 390401A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH704461A
Other languages
German (de)
Inventor
Erich Dipl Ing Waldkoetter
Schering Hans
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DES69069A external-priority patent/DE1141029B/en
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH390401A publication Critical patent/CH390401A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
    • H01L23/4922Bases or plates or solder therefor having a heterogeneous or anisotropic structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Arc-Extinguishing Devices That Are Switches (AREA)
CH704461A 1960-06-23 1961-06-16 Semiconductor device CH390401A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES69069A DE1141029B (en) 1960-06-23 1960-06-23 Semiconductor device and method for its manufacture
DES71897A DE1153461B (en) 1960-06-23 1960-12-30 Semiconductor device

Publications (1)

Publication Number Publication Date
CH390401A true CH390401A (en) 1965-04-15

Family

ID=25996125

Family Applications (1)

Application Number Title Priority Date Filing Date
CH704461A CH390401A (en) 1960-06-23 1961-06-16 Semiconductor device

Country Status (5)

Country Link
BE (1) BE605338A (en)
CH (1) CH390401A (en)
DE (1) DE1153461B (en)
FR (1) FR1296802A (en)
GB (1) GB914839A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385310A (en) * 1978-03-22 1983-05-24 General Electric Company Structured copper strain buffer
DE3070263D1 (en) * 1979-03-08 1985-04-18 Gen Electric Thermo-compression bonding a semiconductor to strain buffer
DE2936816A1 (en) * 1979-08-17 1981-03-26 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau High current silicon semiconductor cooling system - has wires soldered to metallised islands on surface of silicon disc, extending outwards
SE420964B (en) * 1980-03-27 1981-11-09 Asea Ab COMPOSITION MATERIAL AND SET FOR ITS MANUFACTURING
US5262718A (en) * 1985-08-05 1993-11-16 Raychem Limited Anisotropically electrically conductive article
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
GB8818957D0 (en) * 1988-08-10 1988-09-14 Marconi Electronic Devices Semiconductor devices
DE102012200278A1 (en) * 2012-01-11 2013-07-11 Robert Bosch Gmbh Unpackaged power semiconductor e.g. FET for use in circuit carrier, has electrical conductive individual-conductors extending transverse to surface area, where part of each conductor is connected with surface area in end region

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL208617A (en) * 1955-05-10 1900-01-01
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device

Also Published As

Publication number Publication date
FR1296802A (en) 1962-06-22
BE605338A (en) 1961-10-16
GB914839A (en) 1963-01-09
DE1153461B (en) 1963-08-29

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