FR1289309A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
FR1289309A
FR1289309A FR862166A FR862166A FR1289309A FR 1289309 A FR1289309 A FR 1289309A FR 862166 A FR862166 A FR 862166A FR 862166 A FR862166 A FR 862166A FR 1289309 A FR1289309 A FR 1289309A
Authority
FR
France
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR862166A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Priority to FR862166A priority Critical patent/FR1289309A/en
Application granted granted Critical
Publication of FR1289309A publication Critical patent/FR1289309A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
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    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR862166A 1960-05-18 1961-05-17 Semiconductor device Expired FR1289309A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR862166A FR1289309A (en) 1960-05-18 1961-05-17 Semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES68563A DE1185728B (en) 1960-05-18 1960-05-18 Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element
FR862166A FR1289309A (en) 1960-05-18 1961-05-17 Semiconductor device

Publications (1)

Publication Number Publication Date
FR1289309A true FR1289309A (en) 1962-03-30

Family

ID=63144754

Family Applications (1)

Application Number Title Priority Date Filing Date
FR862166A Expired FR1289309A (en) 1960-05-18 1961-05-17 Semiconductor device

Country Status (4)

Country Link
CH (1) CH391109A (en)
DE (1) DE1185728B (en)
FR (1) FR1289309A (en)
GB (1) GB971703A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1184000B (en) * 1962-05-18 1964-12-23 Siemens Ag Installation of a disc-shaped electrical semiconductor component in a recess of another structural part, in particular a housing of an electrical machine or an additional part carried by this
DE1265874B (en) * 1962-06-21 1968-04-11 Ckd Praha Narodni Podnik Vacuum-tight housing for semiconductor components and process for its manufacture
DE1279847B (en) * 1965-01-13 1968-10-10 Siemens Ag Semiconductor capacitive diode and process for their manufacture

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1299076B (en) * 1966-06-10 1969-07-10 Siemens Ag Semiconductor disk cell arrangement with at least one pair of cells clamped between pressure pieces
JPS5030428B1 (en) * 1969-03-31 1975-10-01
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
CH592961A5 (en) * 1975-09-23 1977-11-15 Bbc Brown Boveri & Cie

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1108663A (en) * 1953-10-19 1956-01-16 Licentia Gmbh Asymmetric electrically conductive system
NL204333A (en) * 1954-01-14 1900-01-01
CH338903A (en) * 1954-10-04 1959-06-15 Westinghouse Electric Corp Cooling device for semiconductor arrangements, in particular for p-n power rectifiers
DE1042762B (en) * 1955-02-26 1958-11-06 Siemens Ag Surface rectifier or transistor, which has at least one of its electrodes in surface contact with a body which dissipates the heat loss
DE1039648B (en) * 1955-04-30 1958-09-25 Siemens Ag Surface rectifier or transistor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1184000B (en) * 1962-05-18 1964-12-23 Siemens Ag Installation of a disc-shaped electrical semiconductor component in a recess of another structural part, in particular a housing of an electrical machine or an additional part carried by this
DE1265874B (en) * 1962-06-21 1968-04-11 Ckd Praha Narodni Podnik Vacuum-tight housing for semiconductor components and process for its manufacture
DE1279847B (en) * 1965-01-13 1968-10-10 Siemens Ag Semiconductor capacitive diode and process for their manufacture

Also Published As

Publication number Publication date
DE1185728B (en) 1965-01-21
GB971703A (en) 1964-10-07
CH391109A (en) 1965-04-30

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