FR1289309A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- FR1289309A FR1289309A FR862166A FR862166A FR1289309A FR 1289309 A FR1289309 A FR 1289309A FR 862166 A FR862166 A FR 862166A FR 862166 A FR862166 A FR 862166A FR 1289309 A FR1289309 A FR 1289309A
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H01L2924/01051—Antimony [Sb]
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- H01L2924/01066—Dysprosium [Dy]
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0495—5th Group
- H01L2924/04953—TaN
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR862166A FR1289309A (en) | 1960-05-18 | 1961-05-17 | Semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES68563A DE1185728B (en) | 1960-05-18 | 1960-05-18 | Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element |
FR862166A FR1289309A (en) | 1960-05-18 | 1961-05-17 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1289309A true FR1289309A (en) | 1962-03-30 |
Family
ID=63144754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR862166A Expired FR1289309A (en) | 1960-05-18 | 1961-05-17 | Semiconductor device |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH391109A (en) |
DE (1) | DE1185728B (en) |
FR (1) | FR1289309A (en) |
GB (1) | GB971703A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1184000B (en) * | 1962-05-18 | 1964-12-23 | Siemens Ag | Installation of a disc-shaped electrical semiconductor component in a recess of another structural part, in particular a housing of an electrical machine or an additional part carried by this |
DE1265874B (en) * | 1962-06-21 | 1968-04-11 | Ckd Praha Narodni Podnik | Vacuum-tight housing for semiconductor components and process for its manufacture |
DE1279847B (en) * | 1965-01-13 | 1968-10-10 | Siemens Ag | Semiconductor capacitive diode and process for their manufacture |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1299076B (en) * | 1966-06-10 | 1969-07-10 | Siemens Ag | Semiconductor disk cell arrangement with at least one pair of cells clamped between pressure pieces |
JPS5030428B1 (en) * | 1969-03-31 | 1975-10-01 | ||
GB1381778A (en) * | 1972-06-08 | 1975-01-29 | Cableform Ltd | Semiconductor clamping means |
CH592961A5 (en) * | 1975-09-23 | 1977-11-15 | Bbc Brown Boveri & Cie |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1108663A (en) * | 1953-10-19 | 1956-01-16 | Licentia Gmbh | Asymmetric electrically conductive system |
NL204333A (en) * | 1954-01-14 | 1900-01-01 | ||
CH338903A (en) * | 1954-10-04 | 1959-06-15 | Westinghouse Electric Corp | Cooling device for semiconductor arrangements, in particular for p-n power rectifiers |
DE1042762B (en) * | 1955-02-26 | 1958-11-06 | Siemens Ag | Surface rectifier or transistor, which has at least one of its electrodes in surface contact with a body which dissipates the heat loss |
DE1039648B (en) * | 1955-04-30 | 1958-09-25 | Siemens Ag | Surface rectifier or transistor |
-
1960
- 1960-05-18 DE DES68563A patent/DE1185728B/en active Pending
-
1961
- 1961-05-09 CH CH546861A patent/CH391109A/en unknown
- 1961-05-17 FR FR862166A patent/FR1289309A/en not_active Expired
- 1961-05-18 GB GB18240/61A patent/GB971703A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1184000B (en) * | 1962-05-18 | 1964-12-23 | Siemens Ag | Installation of a disc-shaped electrical semiconductor component in a recess of another structural part, in particular a housing of an electrical machine or an additional part carried by this |
DE1265874B (en) * | 1962-06-21 | 1968-04-11 | Ckd Praha Narodni Podnik | Vacuum-tight housing for semiconductor components and process for its manufacture |
DE1279847B (en) * | 1965-01-13 | 1968-10-10 | Siemens Ag | Semiconductor capacitive diode and process for their manufacture |
Also Published As
Publication number | Publication date |
---|---|
DE1185728B (en) | 1965-01-21 |
GB971703A (en) | 1964-10-07 |
CH391109A (en) | 1965-04-30 |
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