DE1265874B - Vacuum-tight housing for semiconductor components and process for its manufacture - Google Patents

Description

FEDERAL REPUBLIC OF GERMANY

GERMAN

PATENT OFFICE

EDITORIAL

Int. Cl .:

HOIl

German class: 21g -11/02

Number: 1 265 874

File number: C 30075 VIII c / 21

Filing date: May 30, 1963

Open date: April 11, 1968

The invention relates to a vacuum-tight housing for semiconductor components, consisting of two plate-shaped pick-up electrodes between which the semiconductor system is arranged, and the connected to one another by a socket made of an insulating plastic substance and a process for their manufacture.

Such a housing protects semiconductor systems from the effects of the atmosphere, especially moisture, harmful gases, vapors and impurities of all kinds. However, it is difficult to on the one hand to keep the closure vacuum-tight, on the other hand that which arises in the semiconductor component Dissipate heat to the outside in a satisfactory manner.

It is known a construction in which the plate-shaped pickup electrodes between which the semiconductor component is held to enlarge by circumferential flanges, which are completely in the plastic or plastic material of the socket are included. This requires - based on the Semiconductor system - very large plate dimensions. In addition, this type of construction is asymmetrical To use arrangement of the semiconductor components only with difficulty. Furthermore, the installation of additional connection electrodes problems.

The invention is based on the object of eliminating these disadvantages.

The solution according to the invention is characterized in that the removal electrode plates for Anchoring is frustoconical and has larger bases facing each other, wherein the socket comprises only the lateral surfaces of the truncated cones and the smaller base surfaces which leaves truncated cones free.

With this construction, the pick-up electrodes need only marginally over the semiconductor components to survive. The end face corresponding to almost the entire cross-sectional area and, if applicable part of the circumferential surface is not surrounded by the plastic material and can therefore be the Serve heat dissipation. Nevertheless, there is a secure attachment because the pick-up electrodes their frustoconical surfaces are drawn against each other by the socket. By suitable choice of Thermal expansion coefficient of the plastic substance in comparison to that of the other components can be a moderate compressive stress can be achieved, which compensates for the resulting thermal expansion and avoids undesirable stresses in the semiconductor system.

In particular, the thermal expansion coefficient should be the insulating vacuum-tight casing

for semiconductor components and processes

for its manufacture

Applicant:

CKD Praha, närodni podnik, Prague

Representative:

Dr.-Ing. U. Knoblauch, patent attorney,

6000 Frankfurt, Kühhornshofweg 10

Named as inventor:

Slavomir Kosler,

Raoul Kacirek,

Oldfich Pokorny, Prague;

Petr Spiess, Celakovice;

Dimitrij Lezäl,

Zdenek Zaväzal, Prague (Czechoslovakia)

Claimed priority:

Czechoslovakia June 21, 1962 (3803)

be larger than that of the contact plates.

Since the pick-up electrodes only need to protrude a little over the semiconductor system, one can also attach an auxiliary electrode without difficulty. It can preferably be in the space between the contact plates led out and held by the cylindrical insulating socket and be sealed vacuum-tight. The number of components required is a minimum. Man In the simplest case, only the semiconductor system, the socket, and the two pick-up electrodes are required and optionally the auxiliary electrodes.

Furthermore, difficulties in assembly and control can also be very simple the soldered points can be corrected. In particular, a method for producing the vacuum-tight housing, characterized in that before the heat treatment of the insulating Version all electrical connections of the individual components are provided with a layer of solder

809 538/418

and the subsequent heat treatment takes place at such a temperature that a perfect Soldering of the components is achieved.

The invention is described below in connection with the exemplary embodiments shown in the drawing explained in more detail. It shows

F i g. 1 shows a section through a housing according to the invention and

2 shows a view of a modified housing.

With a semiconductor system 1 there are two contact plates 2 and 3 as well as the necessary auxiliary electrodes 5 in connection. These parts are held together by a socket 4, which consists of a plastic substance of considerable electrical strength and resistance. This version secures on the one hand the vacuum-tight closure of the actual semiconductor system 1 and on the other hand, creates a compressive stress in this system from the outset that compensates for it the expected thermal expansion is used. About a perfect vacuum tightness and that required To secure compressive stress, the contact plates 2, 3 get the shape of cones, their bases facing each other. The coefficient of thermal expansion of the insulating frame is chosen to be slightly higher than that of the contact plates 2, 3. The multi-electrode components such. B. transistors, required electrodes are led out between the contact plates. When assembling, they are through the Filled plastic attached vacuum-tight. All electrical connections of the components are made previously secured by a layer of solder, which is heated during the heat treatment the frame is sufficient to ensure a perfect connection. If necessary, the Plates 2 and 3 according to FIG. 2 provided with connecting screws 6.

Claims (4)

Patent claims: 1. Vacuum-tight housing for semiconductor components, consisting of two plate-shaped pick-up electrodes, between which the semiconductor system is arranged, and which are connected to one another by a socket consisting of an insulating plastic substance, characterized in that the pick-up electrode plates (2, 3) are frustoconical for anchoring and face one another with their larger base areas, the mount (4) only encompassing the lateral surfaces of the truncated cones (2,3) and leaving the smaller base areas of the truncated cones (2, 3) free. 2. Vacuum-tight closure according to claim 1, characterized in that the coefficient of thermal expansion of the insulating mount (4) is greater than that of the contact plates (2, 3). 3. Vacuum-tight closure according to claim 1 and 2, characterized in that auxiliary electrodes are led out in the space between the contact plates (2, 3) and are held and sealed vacuum-tight by the cylindrical insulating socket (4). 4. A method for producing the vacuum-tight housing according to claim 1 to 4, characterized characterized in that before the heat treatment of the insulating socket all electrical Connections of the individual components are provided with a solder layer and the subsequent heat treatment takes place at such a temperature that a perfect Soldering of the components is achieved. Considered publications:
German utility model No. 1 840 496;
French patent specification No. 1289 309. 1 sheet of drawings 809 538/418 4. 6S © Bundesdruckerei Berlin