CH410200A - Vacuum-tight closure for semiconductor elements and processes for their manufacture - Google Patents

Vacuum-tight closure for semiconductor elements and processes for their manufacture

Info

Publication number
CH410200A
CH410200A CH667463A CH667463A CH410200A CH 410200 A CH410200 A CH 410200A CH 667463 A CH667463 A CH 667463A CH 667463 A CH667463 A CH 667463A CH 410200 A CH410200 A CH 410200A
Authority
CH
Switzerland
Prior art keywords
vacuum
manufacture
processes
semiconductor elements
tight closure
Prior art date
Application number
CH667463A
Other languages
German (de)
Inventor
Kosler Slavomir
Kacirek Raoul
Pokorny Oldrich
Spiess Petr
Lezal Dimitrij
Zavazal Zdenek
Original Assignee
Ckd Praha Narodni Podnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Praha Narodni Podnik filed Critical Ckd Praha Narodni Podnik
Publication of CH410200A publication Critical patent/CH410200A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
CH667463A 1962-06-21 1963-05-28 Vacuum-tight closure for semiconductor elements and processes for their manufacture CH410200A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS380362 1962-06-21

Publications (1)

Publication Number Publication Date
CH410200A true CH410200A (en) 1966-03-31

Family

ID=5379168

Family Applications (1)

Application Number Title Priority Date Filing Date
CH667463A CH410200A (en) 1962-06-21 1963-05-28 Vacuum-tight closure for semiconductor elements and processes for their manufacture

Country Status (4)

Country Link
AT (1) AT239310B (en)
CH (1) CH410200A (en)
DE (1) DE1265874B (en)
GB (1) GB1010368A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB926423A (en) * 1960-03-17 1963-05-15 Standard Telephones Cables Ltd Improvements in or relating to semiconductor rectifiers
DE1185728B (en) * 1960-05-18 1965-01-21 Siemens Ag Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element

Also Published As

Publication number Publication date
AT239310B (en) 1965-03-25
GB1010368A (en) 1965-11-17
DE1265874B (en) 1968-04-11

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