FR1279527A - Procédé de fixation d'électrodes de raccordement sur des dispositifs semiconducteurs - Google Patents
Procédé de fixation d'électrodes de raccordement sur des dispositifs semiconducteursInfo
- Publication number
- FR1279527A FR1279527A FR844939A FR844939A FR1279527A FR 1279527 A FR1279527 A FR 1279527A FR 844939 A FR844939 A FR 844939A FR 844939 A FR844939 A FR 844939A FR 1279527 A FR1279527 A FR 1279527A
- Authority
- FR
- France
- Prior art keywords
- semiconductor devices
- connection electrodes
- fixing connection
- fixing
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H01L2924/0495—5th Group
- H01L2924/04953—TaN
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1959S0066325 DE1110323C2 (de) | 1959-12-18 | 1959-12-18 | Verfahren zur Herstellung von Halbleiteranordnungen |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1279527A true FR1279527A (fr) | 1961-12-22 |
Family
ID=7498732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR844939A Expired FR1279527A (fr) | 1959-12-18 | 1960-11-24 | Procédé de fixation d'électrodes de raccordement sur des dispositifs semiconducteurs |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH387807A (fr) |
DE (1) | DE1110323C2 (fr) |
FR (1) | FR1279527A (fr) |
GB (1) | GB903206A (fr) |
-
1959
- 1959-12-18 DE DE1959S0066325 patent/DE1110323C2/de not_active Expired
-
1960
- 1960-10-25 CH CH1190460A patent/CH387807A/de unknown
- 1960-11-24 FR FR844939A patent/FR1279527A/fr not_active Expired
- 1960-12-16 GB GB4346360A patent/GB903206A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE1110323C2 (de) | 1962-01-25 |
CH387807A (de) | 1965-02-15 |
DE1110323B (de) | 1961-07-06 |
GB903206A (en) | 1962-08-15 |
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