FR1266244A - Semiconductor cooling device - Google Patents

Semiconductor cooling device

Info

Publication number
FR1266244A
FR1266244A FR836992A FR836992A FR1266244A FR 1266244 A FR1266244 A FR 1266244A FR 836992 A FR836992 A FR 836992A FR 836992 A FR836992 A FR 836992A FR 1266244 A FR1266244 A FR 1266244A
Authority
FR
France
Prior art keywords
cooling device
semiconductor cooling
semiconductor
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR836992A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to FR836992A priority Critical patent/FR1266244A/en
Application granted granted Critical
Publication of FR1266244A publication Critical patent/FR1266244A/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR836992A 1960-08-29 1960-08-29 Semiconductor cooling device Expired FR1266244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR836992A FR1266244A (en) 1960-08-29 1960-08-29 Semiconductor cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR836992A FR1266244A (en) 1960-08-29 1960-08-29 Semiconductor cooling device

Publications (1)

Publication Number Publication Date
FR1266244A true FR1266244A (en) 1961-07-07

Family

ID=8738101

Family Applications (1)

Application Number Title Priority Date Filing Date
FR836992A Expired FR1266244A (en) 1960-08-29 1960-08-29 Semiconductor cooling device

Country Status (1)

Country Link
FR (1) FR1266244A (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3267341A (en) * 1962-02-09 1966-08-16 Hughes Aircraft Co Double container arrangement for transistors
US3412294A (en) * 1965-06-23 1968-11-19 Welding Research Inc Arrangement of the diode as a single unit and in a group
US3675711A (en) * 1970-04-08 1972-07-11 Singer Co Thermal shield
FR2500959A1 (en) * 1981-02-27 1982-09-03 Thomson Csf Housing for electronic devices - comprises base and hood, sealed at periphery contg. liquid which evaporates to dissipate heat via hood
EP0144071A2 (en) * 1983-11-29 1985-06-12 Fujitsu Limited Liquid cooling type high frequency solid state device arrangement
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5632158A (en) * 1995-03-20 1997-05-27 Calsonic Corporation Electronic component cooling unit
US5647430A (en) * 1995-03-20 1997-07-15 Calsonic Corporation Electronic component cooling unit
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5729995A (en) * 1995-03-20 1998-03-24 Calsonic Corporation Electronic component cooling unit
US5924481A (en) * 1995-06-22 1999-07-20 Calsonic Corporation Cooling device for electronic component
US6076595A (en) * 1997-12-31 2000-06-20 Alcatel Usa Sourcing, L.P. Integral heat pipe enclosure
EP1048916A2 (en) * 1999-04-30 2000-11-02 Motorola, Inc. Two-phase thermosyphon including air feed through slots
US6234242B1 (en) * 1999-04-30 2001-05-22 Motorola, Inc. Two-phase thermosyphon including a porous structural material having slots disposed therein
WO2009120589A1 (en) * 2008-03-28 2009-10-01 Raytheon Company Cooling fins for a heat pipe
WO2010000974A1 (en) 2008-06-10 2010-01-07 Airbus Operations Heat dissipation system
US7907395B2 (en) 2008-03-28 2011-03-15 Raytheon Company Heat removal system for computer rooms
WO2012045534A1 (en) * 2010-10-06 2012-04-12 Robert Bosch Gmbh Transmission control device
DE102014213108B3 (en) * 2014-07-07 2015-11-05 Robert Bosch Gmbh Power module with fluid cooling

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3267341A (en) * 1962-02-09 1966-08-16 Hughes Aircraft Co Double container arrangement for transistors
US3412294A (en) * 1965-06-23 1968-11-19 Welding Research Inc Arrangement of the diode as a single unit and in a group
US3675711A (en) * 1970-04-08 1972-07-11 Singer Co Thermal shield
US3811493A (en) * 1970-04-08 1974-05-21 Singer Co Thermal shield
FR2500959A1 (en) * 1981-02-27 1982-09-03 Thomson Csf Housing for electronic devices - comprises base and hood, sealed at periphery contg. liquid which evaporates to dissipate heat via hood
EP0144071A2 (en) * 1983-11-29 1985-06-12 Fujitsu Limited Liquid cooling type high frequency solid state device arrangement
EP0144071A3 (en) * 1983-11-29 1985-09-25 Fujitsu Limited Liquid cooling type high frequency solid state device arrangement
US4796155A (en) * 1983-11-29 1989-01-03 Fujitsu Limited Liquid cooling type high frequency solid state device
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5729995A (en) * 1995-03-20 1998-03-24 Calsonic Corporation Electronic component cooling unit
US5647430A (en) * 1995-03-20 1997-07-15 Calsonic Corporation Electronic component cooling unit
US5632158A (en) * 1995-03-20 1997-05-27 Calsonic Corporation Electronic component cooling unit
US5924481A (en) * 1995-06-22 1999-07-20 Calsonic Corporation Cooling device for electronic component
US6076595A (en) * 1997-12-31 2000-06-20 Alcatel Usa Sourcing, L.P. Integral heat pipe enclosure
US6234242B1 (en) * 1999-04-30 2001-05-22 Motorola, Inc. Two-phase thermosyphon including a porous structural material having slots disposed therein
US6148905A (en) * 1999-04-30 2000-11-21 Motorola, Inc. Two-phase thermosyphon including air feed through slots
EP1048916A2 (en) * 1999-04-30 2000-11-02 Motorola, Inc. Two-phase thermosyphon including air feed through slots
EP1048916A3 (en) * 1999-04-30 2002-04-03 Motorola, Inc. Two-phase thermosyphon including air feed through slots
WO2009120589A1 (en) * 2008-03-28 2009-10-01 Raytheon Company Cooling fins for a heat pipe
US7907395B2 (en) 2008-03-28 2011-03-15 Raytheon Company Heat removal system for computer rooms
WO2010000974A1 (en) 2008-06-10 2010-01-07 Airbus Operations Heat dissipation system
US20110139430A1 (en) * 2008-06-10 2011-06-16 Airbus Operations S.A.S. Heat dissipation system
WO2012045534A1 (en) * 2010-10-06 2012-04-12 Robert Bosch Gmbh Transmission control device
CN103119334A (en) * 2010-10-06 2013-05-22 罗伯特·博世有限公司 Transmission control device
DE102014213108B3 (en) * 2014-07-07 2015-11-05 Robert Bosch Gmbh Power module with fluid cooling

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