FR1257988A - Semi-conducteur - Google Patents

Semi-conducteur

Info

Publication number
FR1257988A
FR1257988A FR827886A FR827886A FR1257988A FR 1257988 A FR1257988 A FR 1257988A FR 827886 A FR827886 A FR 827886A FR 827886 A FR827886 A FR 827886A FR 1257988 A FR1257988 A FR 1257988A
Authority
FR
France
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR827886A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Czech Academy of Sciences CAS
Original Assignee
Czech Academy of Sciences CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Czech Academy of Sciences CAS filed Critical Czech Academy of Sciences CAS
Priority to FR827886A priority Critical patent/FR1257988A/fr
Application granted granted Critical
Publication of FR1257988A publication Critical patent/FR1257988A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
FR827886A 1959-05-19 1960-05-19 Semi-conducteur Expired FR1257988A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR827886A FR1257988A (fr) 1959-05-19 1960-05-19 Semi-conducteur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CS293459 1959-05-19
FR827886A FR1257988A (fr) 1959-05-19 1960-05-19 Semi-conducteur

Publications (1)

Publication Number Publication Date
FR1257988A true FR1257988A (fr) 1961-04-07

Family

ID=25745714

Family Applications (1)

Application Number Title Priority Date Filing Date
FR827886A Expired FR1257988A (fr) 1959-05-19 1960-05-19 Semi-conducteur

Country Status (1)

Country Link
FR (1) FR1257988A (fr)

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