FR1243283A - Semi-conducteur en boîtier ou capsule - Google Patents
Semi-conducteur en boîtier ou capsuleInfo
- Publication number
- FR1243283A FR1243283A FR813724A FR813724A FR1243283A FR 1243283 A FR1243283 A FR 1243283A FR 813724 A FR813724 A FR 813724A FR 813724 A FR813724 A FR 813724A FR 1243283 A FR1243283 A FR 1243283A
- Authority
- FR
- France
- Prior art keywords
- capsule
- package
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US782822A US2985806A (en) | 1958-12-24 | 1958-12-24 | Semiconductor fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1243283A true FR1243283A (fr) | 1960-10-07 |
Family
ID=25127272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR813724A Expired FR1243283A (fr) | 1958-12-24 | 1959-12-21 | Semi-conducteur en boîtier ou capsule |
Country Status (4)
Country | Link |
---|---|
US (1) | US2985806A (fr) |
DE (1) | DE1133833B (fr) |
FR (1) | FR1243283A (fr) |
GB (1) | GB929967A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1246888B (de) * | 1960-11-24 | 1967-08-10 | Semikron Gleichrichterbau | Verfahren zum Herstellen von Gleichrichter-anordnungen fuer kleine Stromstaerken |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL109858C (fr) * | 1957-09-20 | 1900-01-01 | ||
US3364397A (en) * | 1959-05-06 | 1968-01-16 | Texas Instruments Inc | Semiconductor network inverter circuit |
US3435516A (en) * | 1959-05-06 | 1969-04-01 | Texas Instruments Inc | Semiconductor structure fabrication |
US3206619A (en) * | 1960-10-28 | 1965-09-14 | Westinghouse Electric Corp | Monolithic transistor and diode structure |
US3171187A (en) * | 1962-05-04 | 1965-03-02 | Nippon Electric Co | Method of manufacturing semiconductor devices |
US3381080A (en) * | 1962-07-02 | 1968-04-30 | Westinghouse Electric Corp | Hermetically sealed semiconductor device |
US3404213A (en) * | 1962-07-26 | 1968-10-01 | Owens Illinois Inc | Hermetic packages for electronic components |
US3204023A (en) * | 1963-03-01 | 1965-08-31 | Texas Instruments Inc | Semiconductor device header with semiconductor support |
US3231797A (en) * | 1963-09-20 | 1966-01-25 | Nat Semiconductor Corp | Semiconductor device |
GB1015909A (en) * | 1963-12-30 | 1966-01-05 | Gen Micro Electronics Inc | Method of and product for packaging electronic devices |
US3360852A (en) * | 1964-05-08 | 1968-01-02 | Frenchtown Porcelain Company | Manufacture of ceramic bases |
US3287795A (en) * | 1964-06-05 | 1966-11-29 | Western Electric Co | Methods of assembling electrical components with circuits |
US3324530A (en) * | 1964-07-24 | 1967-06-13 | Ralph L Sherwood | Connector support assembly for transistor connector and method of making the support assembly |
US3270391A (en) * | 1964-08-31 | 1966-09-06 | Gen Electric | Electron discharge device assembly and method for manufacture thereof |
US3375343A (en) * | 1964-08-31 | 1968-03-26 | Gen Electric | Electron discharge device assembly method |
US3283224A (en) * | 1965-08-18 | 1966-11-01 | Trw Semiconductors Inc | Mold capping semiconductor device |
NL6604965A (fr) * | 1966-04-14 | 1967-10-16 | ||
US3524249A (en) * | 1966-10-08 | 1970-08-18 | Nippon Electric Co | Method of manufacturing a semiconductor container |
JPS4826069B1 (fr) * | 1968-03-04 | 1973-08-04 | ||
US3478161A (en) * | 1968-03-13 | 1969-11-11 | Rca Corp | Strip-line power transistor package |
US4470648A (en) * | 1982-12-27 | 1984-09-11 | Ford Motor Company | Interconnection construction to thick film substrate |
JPS6092829U (ja) * | 1983-11-30 | 1985-06-25 | アルプス電気株式会社 | マイクロ波トランジスタの取付構造体 |
FR2584862B1 (fr) * | 1985-07-12 | 1988-05-20 | Eurotechnique Sa | Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede |
US5148264A (en) * | 1990-05-02 | 1992-09-15 | Harris Semiconductor Patents, Inc. | High current hermetic package |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE462923A (fr) * | 1944-04-04 | |||
US2613252A (en) * | 1947-09-23 | 1952-10-07 | Erie Resistor Corp | Electric circuit and component |
NL182156B (nl) * | 1952-10-20 | Flamemaster Corp | Zelfdovende brandwerende samenstelling en voorwerpen daarmee bekleed. | |
US2696575A (en) * | 1953-06-05 | 1954-12-07 | Motorola Inc | Transistor unit |
US2783416A (en) * | 1953-06-26 | 1957-02-26 | Joseph E Butler | Circuit housing |
NL90869C (fr) * | 1953-11-07 | |||
BE534031A (fr) * | 1953-12-12 | |||
US2879458A (en) * | 1957-10-30 | 1959-03-24 | Westinghouse Electric Corp | Diode matrix |
-
1958
- 1958-12-24 US US782822A patent/US2985806A/en not_active Expired - Lifetime
-
1959
- 1959-12-15 DE DEP24075A patent/DE1133833B/de active Pending
- 1959-12-21 FR FR813724A patent/FR1243283A/fr not_active Expired
- 1959-12-23 GB GB43674/59A patent/GB929967A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1246888B (de) * | 1960-11-24 | 1967-08-10 | Semikron Gleichrichterbau | Verfahren zum Herstellen von Gleichrichter-anordnungen fuer kleine Stromstaerken |
Also Published As
Publication number | Publication date |
---|---|
US2985806A (en) | 1961-05-23 |
GB929967A (en) | 1963-06-26 |
DE1133833B (de) | 1962-07-26 |
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