FR1240414A - Diode - Google Patents
DiodeInfo
- Publication number
- FR1240414A FR1240414A FR810090A FR810090A FR1240414A FR 1240414 A FR1240414 A FR 1240414A FR 810090 A FR810090 A FR 810090A FR 810090 A FR810090 A FR 810090A FR 1240414 A FR1240414 A FR 1240414A
- Authority
- FR
- France
- Prior art keywords
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77385858A | 1958-11-14 | 1958-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1240414A true FR1240414A (en) | 1960-09-02 |
Family
ID=25099534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR810090A Expired FR1240414A (en) | 1958-11-14 | 1959-11-13 | Diode |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE1167453B (en) |
| FR (1) | FR1240414A (en) |
| GB (2) | GB907269A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3019239A1 (en) * | 1980-05-20 | 1981-11-26 | SIEMENS AG AAAAA, 1000 Berlin und 8000 München | Semiconductor encapsulation with layers of differing hardness layer fo - has semiconductor embedded in second layer of soft material for protection against external effects and degradation |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2822307A (en) * | 1953-04-24 | 1958-02-04 | Sylvania Electric Prod | Technique for multiple p-n junctions |
| NL190331A (en) * | 1954-08-26 | 1900-01-01 | ||
| US2801375A (en) * | 1955-08-01 | 1957-07-30 | Westinghouse Electric Corp | Silicon semiconductor devices and processes for making them |
| GB797304A (en) * | 1955-12-19 | 1958-07-02 | Gen Electric Co Ltd | Improvements in or relating to the manufacture of semiconductor devices |
-
1959
- 1959-11-13 FR FR810090A patent/FR1240414A/en not_active Expired
- 1959-11-13 GB GB3995761A patent/GB907269A/en not_active Expired
- 1959-11-13 DE DES65831A patent/DE1167453B/en active Pending
- 1959-11-13 GB GB3854159A patent/GB907268A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3019239A1 (en) * | 1980-05-20 | 1981-11-26 | SIEMENS AG AAAAA, 1000 Berlin und 8000 München | Semiconductor encapsulation with layers of differing hardness layer fo - has semiconductor embedded in second layer of soft material for protection against external effects and degradation |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1167453B (en) | 1964-04-09 |
| GB907269A (en) | 1962-10-03 |
| GB907268A (en) | 1962-10-03 |
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