FR1229156A - Procédé et appareils de fabrication de pièces détachées électriques - Google Patents

Procédé et appareils de fabrication de pièces détachées électriques

Info

Publication number
FR1229156A
FR1229156A FR798903A FR798903A FR1229156A FR 1229156 A FR1229156 A FR 1229156A FR 798903 A FR798903 A FR 798903A FR 798903 A FR798903 A FR 798903A FR 1229156 A FR1229156 A FR 1229156A
Authority
FR
France
Prior art keywords
spare parts
manufacturing electrical
electrical spare
manufacturing
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR798903A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Space Systems Loral LLC
Original Assignee
Philco Ford Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philco Ford Corp filed Critical Philco Ford Corp
Application granted granted Critical
Publication of FR1229156A publication Critical patent/FR1229156A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67023Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00Abrasive blasting machines or devices; Plants
    • B24C3/32Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/02Etching
    • C25F3/12Etching of semiconducting materials
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
FR798903A 1958-08-20 1959-06-30 Procédé et appareils de fabrication de pièces détachées électriques Expired FR1229156A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US756192A US3012921A (en) 1958-08-20 1958-08-20 Controlled jet etching of semiconductor units

Publications (1)

Publication Number Publication Date
FR1229156A true FR1229156A (fr) 1960-09-05

Family

ID=25042400

Family Applications (1)

Application Number Title Priority Date Filing Date
FR798903A Expired FR1229156A (fr) 1958-08-20 1959-06-30 Procédé et appareils de fabrication de pièces détachées électriques

Country Status (4)

Country Link
US (1) US3012921A (fr)
DE (1) DE1183600B (fr)
FR (1) FR1229156A (fr)
GB (1) GB924154A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1223953B (de) * 1962-02-02 1966-09-01 Siemens Ag Verfahren zum Herstellen eines Halbleiterstrom-tors durch Abtragen von Halbleitermaterial
EP0202338A1 (fr) * 1984-11-06 1986-11-26 Niigata Engineering Co., Ltd. Procede et dispositif de traitement de pieces a usiner a l'aide d'une unite de sablage
EP0213773A2 (fr) * 1985-08-06 1987-03-11 Niigata Engineering Co., Ltd. Procédé et dispositif pour grenailler une pièce

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL110575C (fr) * 1958-01-17 1965-02-15 Philips Nv
US3039514A (en) * 1959-01-16 1962-06-19 Philco Corp Fabrication of semiconductor devices
GB967002A (en) * 1961-05-05 1964-08-19 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3209428A (en) * 1961-07-20 1965-10-05 Westinghouse Electric Corp Process for treating semiconductor devices
US4027686A (en) * 1973-01-02 1977-06-07 Texas Instruments Incorporated Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
US4359360A (en) * 1981-12-10 1982-11-16 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for selectively jet etching a plastic encapsulating an article
US4682615A (en) * 1984-07-02 1987-07-28 Fsi Corporation Rinsing in acid processing of substrates
US4801335A (en) * 1984-07-02 1989-01-31 Fsi Corporation Rinsing in acid processing of substrates
US4635666A (en) * 1985-04-22 1987-01-13 Daley Frank E Batch cleaning apparatus
KR100187445B1 (ko) * 1996-06-05 1999-04-15 김광호 웨이퍼 세정 방법 및 장치
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6705331B2 (en) * 2000-11-20 2004-03-16 Dainippon Screen Mfg., Co., Ltd. Substrate cleaning apparatus
CA2595807C (fr) * 2005-02-04 2012-07-17 Edk Research Ag Dispositif d'usinage de surface electrolytique des metaux
DE102007012859B4 (de) * 2007-03-17 2009-01-02 Josef Albrecht Bohrfutterfabrik Gmbh & Co. Kg Spülbares Futter
US8893519B2 (en) * 2008-12-08 2014-11-25 The Hong Kong University Of Science And Technology Providing cooling in a machining process using a plurality of activated coolant streams
AU355903S (en) * 2014-05-12 2014-06-13 Electrolytic brush
AU355902S (en) * 2014-05-12 2014-06-13 Electrolytic brush
GB201713930D0 (en) * 2017-08-31 2017-10-18 Univ Leuven Kath Rotor gas accelerator system and methods

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1345219A (en) * 1919-01-07 1920-06-29 William F Nicholas Etching-machine
US2088542A (en) * 1933-10-06 1937-07-27 Stokes Machine Co Automatic coating machine
BE420834A (fr) * 1936-03-30
US2261988A (en) * 1937-04-08 1941-11-11 Arthur H Gaebel Etching apparatus
US2242032A (en) * 1937-10-30 1941-05-13 Chrysler Corp Mask
US2523018A (en) * 1946-12-12 1950-09-19 Paper Patents Co Method of cylinder etching and machine therefor
NL175652B (nl) * 1952-02-07 Krings Josef Glijschoen voor een spaninrichting van een greppelbouwinrichting.
NL180750B (nl) * 1952-08-20 Bristol Myers Co Werkwijze voor het bereiden van een 7-amino-3-cefem-4-carbonzuur derivaat door een 7-acylamino-3-cefem-4-carbonzuur derivaat om te zetten.
DE966879C (de) * 1953-02-21 1957-09-12 Standard Elektrik Ag Verfahren zur Reinigung und/oder Abtragung von Halbleitermaterial, insbesondere von Germanium- und Siliziumsubstanz
US2748325A (en) * 1953-04-16 1956-05-29 Rca Corp Semi-conductor devices and methods for treating same
US2849341A (en) * 1953-05-01 1958-08-26 Rca Corp Method for making semi-conductor devices
GB774388A (en) * 1954-01-28 1957-05-08 Marconi Wireless Telegraph Co Improvements in or relating to semi-conducting amplifiers
US2767137A (en) * 1954-07-15 1956-10-16 Philco Corp Method for electrolytic etching
US2799637A (en) * 1954-12-22 1957-07-16 Philco Corp Method for electrolytic etching
NL104994C (fr) * 1955-06-23

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1223953B (de) * 1962-02-02 1966-09-01 Siemens Ag Verfahren zum Herstellen eines Halbleiterstrom-tors durch Abtragen von Halbleitermaterial
EP0202338A1 (fr) * 1984-11-06 1986-11-26 Niigata Engineering Co., Ltd. Procede et dispositif de traitement de pieces a usiner a l'aide d'une unite de sablage
EP0202338A4 (fr) * 1984-11-06 1988-07-14 Niigata Engineering Co Ltd Procede et dispositif de traitement de pieces a usiner a l'aide d'une unite de sablage.
EP0213773A2 (fr) * 1985-08-06 1987-03-11 Niigata Engineering Co., Ltd. Procédé et dispositif pour grenailler une pièce
EP0213773A3 (en) * 1985-08-06 1988-09-14 Niigata Engineering Co., Ltd. Method and apparatus for sandblasting a work

Also Published As

Publication number Publication date
GB924154A (en) 1963-04-24
DE1183600B (de) 1964-12-17
US3012921A (en) 1961-12-12

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