FR1167761A - Method and apparatus for cathodic projection of metal and dielectric films - Google Patents
Method and apparatus for cathodic projection of metal and dielectric filmsInfo
- Publication number
- FR1167761A FR1167761A FR1167761DA FR1167761A FR 1167761 A FR1167761 A FR 1167761A FR 1167761D A FR1167761D A FR 1167761DA FR 1167761 A FR1167761 A FR 1167761A
- Authority
- FR
- France
- Prior art keywords
- metal
- dielectric films
- cathodic
- projection
- cathodic projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/146—Sheet resistance, dopant parameters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/158—Sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/169—Vacuum deposition, e.g. including molecular beam epitaxy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB30944/55A GB830391A (en) | 1955-10-28 | 1955-10-28 | Improvements in or relating to cathodic sputtering of metal and dielectric films |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1167761A true FR1167761A (en) | 1958-11-28 |
Family
ID=10315555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1167761D Expired FR1167761A (en) | 1955-10-28 | 1956-10-27 | Method and apparatus for cathodic projection of metal and dielectric films |
Country Status (4)
Country | Link |
---|---|
US (1) | US2886502A (en) |
DE (1) | DE1116015B (en) |
FR (1) | FR1167761A (en) |
GB (1) | GB830391A (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3039952A (en) * | 1959-03-25 | 1962-06-19 | Western Electric Co | Apparatus for depositing films on article surfaces |
US3220938A (en) * | 1961-03-09 | 1965-11-30 | Bell Telephone Labor Inc | Oxide underlay for printed circuit components |
US3257305A (en) * | 1961-08-14 | 1966-06-21 | Texas Instruments Inc | Method of manufacturing a capacitor by reactive sputtering of tantalum oxide onto a silicon substrate |
NL124711C (en) * | 1961-10-03 | |||
US3271488A (en) * | 1961-11-21 | 1966-09-06 | Itt | Method of making masks for vapor deposition of electrodes |
US3324019A (en) * | 1962-12-11 | 1967-06-06 | Schjeldahl Co G T | Method of sputtering sequentially from a plurality of cathodes |
US3450581A (en) * | 1963-04-04 | 1969-06-17 | Texas Instruments Inc | Process of coating a semiconductor with a mask and diffusing an impurity therein |
GB1054660A (en) * | 1963-09-16 | |||
LU45647A1 (en) * | 1964-03-12 | 1965-09-13 | ||
US3351543A (en) * | 1964-05-28 | 1967-11-07 | Gen Electric | Process of coating diamond with an adherent metal coating using cathode sputtering |
US3369989A (en) * | 1964-07-22 | 1968-02-20 | Ibm | Cathode sputtering apparatus including precision temperature control of substrate |
US3457614A (en) * | 1964-09-29 | 1969-07-29 | Gen Instrument Corp | Process and apparatus for making thin film capacitors |
US3716472A (en) * | 1966-02-04 | 1973-02-13 | Siemens Ag | Cathode atomization apparatus |
DE1515314C2 (en) * | 1966-02-04 | 1973-12-13 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Device for cathode sputtering with ring discharge |
US3616401A (en) * | 1966-06-30 | 1971-10-26 | Texas Instruments Inc | Sputtered multilayer ohmic molygold contacts for semiconductor devices |
US3350293A (en) * | 1966-11-14 | 1967-10-31 | Components Inc | Passivating silicon semiconductor devices with sputtered tungsten oxide at low temperatures |
US3507248A (en) * | 1967-06-15 | 1970-04-21 | Ibm | Vacuum evaporation coating apparatus including means for precleaning substrates by ion bombardment |
US3660180A (en) * | 1969-02-27 | 1972-05-02 | Ibm | Constrainment of autodoping in epitaxial deposition |
GB1446848A (en) * | 1972-11-29 | 1976-08-18 | Triplex Safety Glass Co | Sputtered metal oxide coatings articles comprising transparent electrically-conductive coatings on non-conducting substrates |
US4166018A (en) * | 1974-01-31 | 1979-08-28 | Airco, Inc. | Sputtering process and apparatus |
US4142958A (en) * | 1978-04-13 | 1979-03-06 | Litton Systems, Inc. | Method for fabricating multi-layer optical films |
DE3306870A1 (en) * | 1983-02-26 | 1984-08-30 | Leybold-Heraeus GmbH, 5000 Köln | DEVICE FOR PRODUCING LAYERS WITH ROTATIONALLY SYMMETRIC THICK PROFILE BY CATODENSIONING |
US4797527A (en) * | 1985-02-06 | 1989-01-10 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Electrode for electric discharge machining and method for producing the same |
US4626336A (en) * | 1985-05-02 | 1986-12-02 | Hewlett Packard Company | Target for sputter depositing thin films |
DE59009235D1 (en) * | 1989-11-30 | 1995-07-20 | Siemens Ag | Process for reducing the reflectivity of sputter layers. |
US6328856B1 (en) | 1999-08-04 | 2001-12-11 | Seagate Technology Llc | Method and apparatus for multilayer film deposition utilizing rotating multiple magnetron cathode device |
JP4167833B2 (en) * | 2002-01-24 | 2008-10-22 | 株式会社ユーテック | Film forming apparatus, oxide thin film forming substrate and manufacturing method thereof |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US929017A (en) * | 1906-02-14 | 1909-07-27 | James K Reynard | Metal-depositing apparatus. |
DE542404C (en) * | 1929-03-06 | 1932-01-23 | Steatit Magnesia Akt Ges | Process for the production of high value resistors |
US1917271A (en) * | 1932-01-28 | 1933-07-11 | James G Potter | Method of forming coatings of metal and product thereof |
US2160981A (en) * | 1935-10-19 | 1939-06-06 | O'brien Brian | Method and apparatus for producing thin wedges |
US2189580A (en) * | 1937-05-29 | 1940-02-06 | Gen Electric | Method of making a photoelectric cell |
GB541739A (en) * | 1940-07-16 | 1941-12-09 | Gabor Adam Veszi | Improvements in or relating to photo electric cells |
US2373639A (en) * | 1943-01-23 | 1945-04-10 | Bausch & Lomb | Method and apparatus for forming films |
FR1107451A (en) * | 1949-11-08 | 1956-01-03 | Materiel Telephonique | Improvements in the manufacture of dry straighteners, in particular selenium |
-
1955
- 1955-10-28 GB GB30944/55A patent/GB830391A/en not_active Expired
-
1956
- 1956-10-23 US US617867A patent/US2886502A/en not_active Expired - Lifetime
- 1956-10-27 DE DEE13491A patent/DE1116015B/en active Pending
- 1956-10-27 FR FR1167761D patent/FR1167761A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB830391A (en) | 1960-03-16 |
DE1116015B (en) | 1961-10-26 |
US2886502A (en) | 1959-05-12 |
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