Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
  • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Applications Claiming Priority (1)

Publications (1)

Family

ID=19784535

Family Applications (1)

Country Status (3)

• 1955
  • 1955-07-11 GB GB19986/55A patent/GB789286A/en not_active Expired
  • 1955-07-12 CH CH335767D patent/CH335767A/de unknown
  • 1955-07-12 FR FR1137408D patent/FR1137408A/fr not_active Expired

Also Published As

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