FR1118488A - Systèmes d'électrodes comportant un corps semi-conducteur et au moins une électrode combinée - Google Patents

Systèmes d'électrodes comportant un corps semi-conducteur et au moins une électrode combinée

Info

Publication number
FR1118488A
FR1118488A FR1118488DA FR1118488A FR 1118488 A FR1118488 A FR 1118488A FR 1118488D A FR1118488D A FR 1118488DA FR 1118488 A FR1118488 A FR 1118488A
Authority
FR
France
Prior art keywords
electrode
semiconductor body
combined
systems
electrode systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of FR1118488A publication Critical patent/FR1118488A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Wire Processing (AREA)
FR1118488D 1953-12-23 1954-12-21 Systèmes d'électrodes comportant un corps semi-conducteur et au moins une électrode combinée Expired FR1118488A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL332302X 1953-12-23

Publications (1)

Publication Number Publication Date
FR1118488A true FR1118488A (fr) 1956-06-06

Family

ID=19784416

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1118488D Expired FR1118488A (fr) 1953-12-23 1954-12-21 Systèmes d'électrodes comportant un corps semi-conducteur et au moins une électrode combinée

Country Status (7)

Country Link
US (1) US2926290A (US20020095090A1-20020718-M00002.png)
BE (1) BE534311A (US20020095090A1-20020718-M00002.png)
CH (1) CH332302A (US20020095090A1-20020718-M00002.png)
DE (1) DE1080695B (US20020095090A1-20020718-M00002.png)
FR (1) FR1118488A (US20020095090A1-20020718-M00002.png)
GB (1) GB776085A (US20020095090A1-20020718-M00002.png)
NL (2) NL183885B (US20020095090A1-20020718-M00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1058158B (de) * 1956-04-25 1959-05-27 Philips Nv Verfahren zum Anbringen einer Legierungs-Elektrode auf einem halbleitenden Koerper

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3095622A (en) * 1958-06-11 1963-07-02 Clevite Corp Apparatus for manufacture of alloyed semiconductor devices
US3186046A (en) * 1959-06-10 1965-06-01 Clevite Corp Apparatus for the preparation of alloy contacts

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2402839A (en) * 1941-03-27 1946-06-25 Bell Telephone Labor Inc Electrical translating device utilizing silicon
US2321071A (en) * 1941-06-18 1943-06-08 Bell Telephone Labor Inc Method of assembling dry rectifiers and the like with solder
GB697851A (en) * 1950-06-06 1953-09-30 British Thomson Houston Co Ltd Improvements relating to the utilisation of the photo-electric effect in semi-conductors
NL162993B (nl) * 1950-09-14 Bosch Gmbh Robert Brandstofinspuitinrichting voor mengselcomprimerende verbrandigsmotoren met afzonderlijke ontsteking.
US2792538A (en) * 1950-09-14 1957-05-14 Bell Telephone Labor Inc Semiconductor translating devices with embedded electrode
GB688866A (en) * 1950-10-19 1953-03-18 Gen Electric Co Ltd Improvements in or relating to crystal rectifiers
US2654059A (en) * 1951-05-26 1953-09-29 Bell Telephone Labor Inc Semiconductor signal translating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1058158B (de) * 1956-04-25 1959-05-27 Philips Nv Verfahren zum Anbringen einer Legierungs-Elektrode auf einem halbleitenden Koerper

Also Published As

Publication number Publication date
DE1080695B (de) 1960-04-28
NL183885B (nl)
US2926290A (en) 1960-02-23
GB776085A (en) 1957-06-05
BE534311A (US20020095090A1-20020718-M00002.png)
NL91360C (US20020095090A1-20020718-M00002.png)
CH332302A (de) 1958-08-31

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