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1955-05-10 |
1967-01-17 |
Texas Instruments Inc |
Transistor structure with heatconductive housing for cooling
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1955-09-30 |
1958-04-08 |
Hughes Aircraft Co |
Heat dissipating semiconductor device
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1955-11-08 |
1957-09-10 |
Westinghouse Electric Corp |
Semiconductor rectifier device
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1956-03-09 |
1960-03-29 |
Sarkes Tarzian |
Semiconductor device
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*
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1956-09-07 |
1961-07-25 |
Int Rectifier Corp |
Air-cooled rectifier assembly
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*
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1956-10-12 |
1959-03-17 |
Rca Corp |
Silicon junction devices
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*
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1956-11-27 |
1960-10-04 |
Raytheon Co |
Hermetically sealed power transistors
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1957-03-27 |
1964-05-21 |
Licentia Gmbh |
Verfahren zum Einbau einer Halbleiteranordnung in ein Gehaeuse
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*
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1957-05-02 |
1961-04-25 |
Sarkes Tarzian |
Semiconductor device
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*
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1957-05-27 |
1959-10-20 |
Int Rectifier Corp |
Hermetically sealed rectifier
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*
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1957-08-20 |
1962-02-13 |
Texas Instruments Inc |
Semiconductor translating device with silicone fluid filler
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*
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1958-01-10 |
1961-06-06 |
Philco Corp |
Improved semiconductor diode
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*
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1958-11-17 |
1962-09-11 |
Rolland C Sabins |
Heat sink for a. c.-d. c. rectifier
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1959-01-28 |
1965-11-25 |
Bosch Gmbh Robert |
Halbleiteranordnung
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1960-02-10 |
1964-01-02 |
Siemens Ag |
Verfahren zur Herstellung einer Verbindung durch Loetung bzw. Legierung an Halbleiteranordnungen
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1960-02-11 |
1966-06-30 |
Siemens Ag |
Verfahren zum Herstellen von Halbleiter-bauelementen
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1960-12-16 |
1964-10-06 |
Ruben Samuel |
Sealed semiconductor device and mounting means therefor
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*
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1961-02-24 |
1966-01-18 |
Hughes Aircraft Co |
Method of making semiconductor devices
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1961-02-24 |
1965-12-14 |
Hughes Aircraft Co |
Point contact semiconductor device with a lead having low effective ratio of length to diameter
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1961-07-24 |
1966-07-28 |
Siemens Ag |
In einer isolierenden Masse vergossenes Halbleiterelment
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1962-11-07 |
1967-01-03 |
Westinghouse Electric Corp |
Metallic ceramic composite contacts for semiconductor devices
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*
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1963-10-11 |
1966-12-27 |
American Mach & Foundry |
Semiconductor device
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*
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1964-04-03 |
1966-10-11 |
Westinghouse Electric Corp |
Heat transfer apparatus for electronic component
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1966-07-14 |
1967-07-31 |
Bbc Brown Boveri & Cie |
Kühlkörper für Halbleiterelemente
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1973-07-13 |
1975-12-09 |
Ford Motor Co |
Semi-conductor rectifier heat sink
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1979-08-03 |
1982-11-25 |
Siemens AG, 1000 Berlin und 8000 München |
Verfahren zum Einbringen eines Getterstoffes in das Gehäuse eines elektrischen Bauelementes
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1985-12-03 |
1988-10-04 |
Wells Manufacturing Company |
Thermal compensated circuit board interconnect apparatus and method of forming the same
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2018-01-08 |
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파워 모듈 및 그 제조 방법
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